SANTA CLARA, CA and BARCELONA, Spain, June 12, 2026 – Baya Systems and Openchip have announced a partnership that will allow Openchip to use Baya’s data-movement platform and Network-on-Chip (NoC) fabric technology in next-generation intelligent compute systems. The agreement gives Openchip access to Baya’s interconnect technology for future AI and high-performance computing (HPC) designs and extends Baya’s presence in Europe following the opening of its UK offices this year.
Openchip will use Baya’s WeaveIP fabric to develop specialized compute systems for next-generation AI workloads. Baya’s WeaverPro FabricStudio platform will support the design and optimization of Openchip’s RISC-V-based multi-chiplet systems, with a focus on system efficiency, performance, and scale. Baya’s software-driven platform is intended to help Openchip model and validate data-movement architecture before physical silicon implementation, reducing development risk, shortening time-to-market, and optimizing power-performance-area (PPA) at scale.
“The fundamental challenges facing AI hardware today – scalability, thermal efficiency and uncompromised performance – cannot be solved if interconnect is treated as an afterthought,” said Dr. Sailesh Kumar, CEO and founder of Baya Systems. “The communication layer between memory and compute is the critical connective tissue of the AI stack. Our collaboration with Openchip enables them to address data movement explicitly and early to build their state-of-art systems with the performance and efficiency the market now demands within the ever-shrinking time-to-market window.”
“Innovation in the modern semiconductor landscape requires tight collaboration between leading-edge IP and system architecture,” added Cesc Guim, CEO of Openchip. “Baya’s data-movement platform provides the architectural foundation we need to deliver scalable, next-generation computing platforms. We welcome Baya’s expanding presence in Europe and look forward to driving the future of RISC-V innovation together.”
The partnership comes at a time when Baya Systems is expanding internationally. After opening its UK office in Cambridge earlier this year, the company is evaluating sites for its first EU-based office to support its European customer base. Openchip is also scaling from its Barcelona headquarters, with operations across six European countries: Spain, Italy, Poland, France, Germany, and Ireland.
Source: Baya Systems
About Baya Systems
Baya Systems develops fabric intellectual property and software tools for system-on-chip (SoC) and chiplet-based designs. Its interconnect technologies manage data movement, communication, and integration across computing systems. The company serves semiconductor companies, system designers, chip developers, and technology firms working on AI, high-performance computing, data center, automotive, and other compute-intensive applications. Baya Systems was founded in 2023 and is based in Santa Clara, CA. It also has operations in India, the United Kingdom, and Texas. The company focuses on performance, scalability, and integration issues in semiconductor designs.
About Openchip
Openchip develops processors, accelerators and software for AI and high-performance computing. The company designs RISC-V-based chips and hardware-software systems for data centers, cloud computing, edge computing, telecommunications, automotive, health care, meteorology and scientific research. It serves research institutions, government programs, technology companies, data center operators and industrial organizations. Openchip was founded in 2021 and is headquartered in Barcelona, Spain. It also operates offices and engineering centers in Italy, Germany, Ireland, Poland and Belgium. The company began as a joint venture between GTD Systems and Software Engineering and the Barcelona Supercomputing Center. Openchip employs more than 300 people worldwide. The company participates in European semiconductor and computing programs that support processor development and computing systems for scientific, industrial and commercial use.