ARTICLES

High-Entropy Design Opens a New Path for Semiconductor Materials

Researchers transform an insulating metal oxide into a high-performance semiconductor with exceptional thermal properties.

Simulation Helps Engineers Build Electronics That Resist Humidity Damage

Researchers use multiphysics modeling to predict corrosion, reduce failures, and improve the reliability of high-voltage electronic systems.

3D Printing Method Cuts Waste in Manufacturing Ultra Hard Carbides

Researchers develop an additive manufacturing process that preserves the strength of tungsten carbide while reducing costly material consumption.

Open Design Alliance Brings AI Directly Into CAD and BIM Workflows

New MCP servers allow AI agents to interact with engineering models through ODA’s trusted software development kits.

New Thermal Metamaterial Gives Scientists Unprecedented Control Over Heat

A reconfigurable device breaks a long accepted rule of thermal radiation, paving the way for smarter infrared technologies.

Benchmark Dispute Puts Physical AI Startup Under the Spotlight

Questions over a global robotics ranking highlight the growing competition and scrutiny surrounding embodied AI.

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