SANTA CLARA, CA and CHANGSHA, China – Intel Corporation and Lens Technology are collaborating on glass substrate-based packaging for semiconductors, targeting higher interconnect density and better power efficiency for AI, data center, and specialized computing applications.
The work combines Intel’s semiconductor packaging and architecture capabilities with Lens Technology’s glass processing, laser manufacturing, and production. The companies will explore manufacturing processes to scale adoption of glass substrate packaging.
“Advanced packaging is becoming a critical driver of semiconductor innovation as AI systems continue to push the boundaries of performance, scale, and efficiency,” said Lip-Bu Tan, CEO of Intel. “Intel brings deep expertise in semiconductor architecture and advanced packaging technologies, while Lens Technology contributes world-class capabilities in precision glass processing, laser manufacturing, and large-scale production. Together, we have an opportunity to explore new approaches to advanced packaging that can help unlock the next generation of system-level innovation for the AI era.”
“Lens Technology has built its leadership on advanced materials engineering and precision manufacturing, serving some of the world’s most demanding technology companies,” said June Chau, founder and chairwoman of Lens Technology. “By combining Lens Technology’s expertise in glass materials, high-precision laser processing, and advanced manufacturing with Intel’s leadership in semiconductor design and packaging, we believe we can help accelerate innovation in advanced packaging technologies. This collaboration will support the rapid development of next-generation computing solutions and AI infrastructure for customers around the world.”
The companies also identified areas for potential future collaboration: components for AI PCs, structural and thermal solutions for data center servers, and hardware platforms for AI robotics, industrial equipment, and edge computing.
Source: Intel
About Intel Corporation
Intel Corporation, founded in 1968 and headquartered in Santa Clara, CA, is a semiconductor manufacturer specializing in processors, chipsets, graphics, and networking components. Its products support computing, data center infrastructure, AI, networking, embedded systems, industrial automation, and automotive applications. Intel designs and manufactures CPUs, GPUs, FPGAs, and silicon technologies used in personal computers, servers, and connected devices. The company operates fabrication facilities in the United States, Ireland, and Israel, along with global assembly and testing operations. With over 110,000 employees, Intel develops computing architectures and supports industries needing scalable processing and connectivity solutions.
About Lens Technology
Lens Technology manufactures components, modules and assembled products for electronics, automotive and industrial applications. Founded in 1993, the company is headquartered in China. Its products include glass, metal, ceramic and plastic structural components for electronic devices. Lens Technology also makes touch, fingerprint, camera and antenna modules and provides device assembly. Its manufacturing operations include tooling, molds, inspection equipment, automation systems and industrial robots. Customers include smartphone, wearable, computer, automotive, AI server and optical communications manufacturers. The company also supplies components for aerospace, robotics, appliances and photovoltaic applications. Lens Technology operates 12 research and production sites in China, Vietnam and Thailand. It also has operations in the United States, Germany, Japan and South Korea. The company reports more than 140,000 employees worldwide.