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Molex Acquires Teramount for Fiber-to-Chip Links

by | May 15, 2026

Jerusalem engineering team joins optical unit as co-packaged optics and silicon photonics demand rises
Molex completes its acquisition of Teramount Ltd., adding detachable wafer‑level fiber‑to‑chip connectivity to accelerate scalable co‑packaged optics.

LISLE, IL, May 15, 2026 – Molex completed its acquisition of Teramount Ltd., adding fiber-to-chip connectivity technology for high-volume co-packaged optics (CPO) and silicon photonics systems. The deal brings Molex focused on detachable optical connections, as AI, data center, and photonics systems push more data between fibers and chips.

“Teramount’s passive, detachable coupling approach supports large assembly tolerances and semiconductor‑grade wafer‑level processes – filling a critical gap in the optical stack,” said Aldo Lopez, president, Datacom Solutions, Molex. “By integrating this unique technology into our optical interconnect portfolio, Molex offers a more seamless path from early-stage prototypes to high-volume CPO and other silicon photonics architectures required for the AI era.”

Teramount will continue to operate as a design and engineering hub in Jerusalem. The business will be integrated into Molex’s Optical Connectivity segment within its Optical Solutions Business.

Source: Molex

About Molex Optical Solutions Business

Molex Optical Solutions Business focuses on fiber optic connectivity and optical network hardware. Parent company Molex traces its history to the 1930s and is headquartered in Lisle, IL. The business supplies fiber optic connectors, adapters, cable assemblies, optical flex circuits, components, modules, specialty fibers, co-packaged optics, wavelength management products and optical line systems. Its optical circuit switch uses MEMS mirrors to create optical paths between fibers and avoid optical-electrical-optical conversion. The switch supports up to 544-by-544 ports, with a roadmap for more than 1,000 ports. Molex serves data center operators, medical equipment companies, networking firms, AI infrastructure teams, cloud providers, telecommunications customers, industrial users and health care customers. It also provides design, manufacturing, integration and related services.

About Molex

Molex, founded in 1938 and headquartered in Lisle, Illinois, is a global manufacturer of electronic, electrical, and fiber optic interconnect solutions. The company offers a portfolio of over 100,000 products, including connectors, cable assemblies, switches, and integrated systems. Its solutions support industries such as automotive, aerospace and defense, data centers, cloud computing, telecommunications, transportation, industrial automation, consumer electronics, and healthcare. Molex is known for developing the Molex connector, widely used in computing hardware. Since being acquired by Koch Industries in 2013, the company has expanded its operations to 72 manufacturing facilities across 18 countries, employing around 42,000 people.

About Teramount Ltd.

Teramount Ltd. is an optical connectivity company based in Jerusalem, Israel. Hesham Taha and Avi Israel founded the company in 2013. Teramount develops detachable fiber-to-chip connectivity for silicon photonics and co-packaged optics. Its products include Universal Photonic Coupler, TeraVERSE, TeraSPOT, Photonic-Plug and Photonic-Bump components. The technology connects optical fibers to silicon photonics chips through wafer-level optical elements and passive alignment methods. Its components also support wafer-level testing for silicon photonics production. Teramount serves semiconductor companies, foundries, outsourced assembly and test vendors, data center operators, AI infrastructure suppliers, high-performance computing firms, communications networks and sensor applications. Molex completed its acquisition of Teramount in May 2026. Teramount continues to operate as a design and engineering hub in Jerusalem within Molex’s Optical Connectivity segment.