LISLE, IL, June 9, 2026 – Molex has brought liquid cooling to the power-distribution layer of AI racks with its Multi-Channel Liquid Cooled Busbars. Presented at Computex 2026, the design supports 15,000 Amps with a design roadmap to 25,000 Amps as AI rack power requirements rise.
“Direct-to-chip cooling is now standard for compute, but for AI to truly scale, we must also address the thermal challenges of the power path,” said Kevin Alberts, VP and GM of the power and signal business unit (PSBU), Molex. “By integrating liquid cooling into the power backbone with our new Multi-Channel Liquid Cooled Busbars, Molex enables customers to maintain stable electrical performance and reduce thermal stress without drastically increasing the physical footprint of the rack.”
The Multi-Channel Architecture
Molex has engineered a multi-channel architecture that divides the coolant path into seven discrete channels. The design extracts heat from the busbar structure, reduces hot spots, and manages thermal stress while supporting stable electrical performance at high currents. The busbars deliver a 15°C T-Rise at 15,000 amps.
Molex simulations indicate that the multi-channel liquid-cooled busbar architecture provides up to 20% greater cooling efficiency than a single-channel design. The layout extracts more heat within the same mechanical footprint, giving data center architects more room to increase rack power density.
Configurable Busbars
Molex has engineered the busbars so customers can configure length, depth, and fluid inlet and outlet points for rack layouts. The design also uses a plug-and-play interface, allowing teams to add liquid-cooled power distribution without redesigning the rack infrastructure.
Rack Compatibility
The busbars maintain footprint compatibility with ORV3 and HPR mechanical standards, supporting integration into data center and AI rack systems. Hyperscalers can pre-install high-capacity power infrastructure for future accelerator deployments and 1-MW rack architectures.
Compatibility with dielectric and non-dielectric liquids allows integration with different facility cooling loops. The Molex Busbars also support transitions from air cooling to liquid cooling while retaining existing rack layouts.
Source: Molex
About Molex
Molex is a U.S. electronics company that designs and manufactures connectors, cable assemblies, sensors, antennas, optical components, power products and printed circuit assemblies. The company serves customers in consumer devices, aerospace and defense, data centers, cloud infrastructure, telecommunications, transportation, industrial automation, health care and automotive markets. Frederick Krehbiel founded Molex in 1938 after developing an industrial plastic material. The company is headquartered in Lisle, IL, and operates as a Koch company. Molex provides product design support, manufacturing, supply chain support and technical resources for electronics manufacturers. Engineers, purchasing teams and product developers use its components in electronic systems and equipment. Molex employs more than 50,000 people worldwide and operates in more than 40 countries.