LISLE, IL, Aug 19, 2026 – Molex has invested in CAEPlus to support further development of the BoundaryCool platform, a compact active cooling architecture aimed at next-generation GPU/ASIC thermal challenges.
BoundaryCool is engineered to deliver higher heat transfer performance and larger reductions in CPU/GPU/TPU chip temperatures compared to passive cold plate solutions. It remains compatible with legacy data center architectures. The investment is part of Molex’s data center thermal management strategy. Under the agreement, Molex holds exclusive licensing to apply CAEPlus technology to its portfolio of pluggable I/O solutions.
“Advanced thermal management is becoming a critical enabler for the next wave of compute performance,” said Jairo Guerrero, VP and GM, copper solutions business, Molex. “Our strategic investment in CAEPlus reflects Molex’s commitment to supporting innovations in liquid cooling while working with emerging technology leaders to help customers address rapidly evolving AI and compute-intensive data center requirements.”
“CAEPlus was founded to address the rapid pace of change in data center cooling requirements by enabling an entirely new class of active liquid cooling solutions,” said Milad Bashirzadeh, founder and CEO, CAEPlus. “In addition to its investment, Molex brings deep engineering expertise and a strong track record of helping scale innovative technologies. We are excited to work together in advancing our proprietary cooling technology and meet unrelenting industry requirements for higher levels of performance and efficiency.”
Source: Molex
About Molex
Molex is a U.S. electronics company that designs and manufactures connectors, cable assemblies, sensors, antennas, optical components, power products and printed circuit assemblies. The company serves customers in consumer devices, aerospace and defense, data centers, cloud infrastructure, telecommunications, transportation, industrial automation, health care and automotive markets. Frederick Krehbiel founded Molex in 1938 after developing an industrial plastic material. The company is headquartered in Lisle, IL, and operates as a Koch company. Molex provides product design support, manufacturing, supply chain support and technical resources for electronics manufacturers. Engineers, purchasing teams and product developers use its components in electronic systems and equipment. Molex employs more than 50,000 people worldwide and operates in more than 40 countries.
About CAEPlus
CAEPlus develops thermal management technology for high-performance computing, data centers and other high-heat applications. Founded in 2021, the company is based in the Chicago area. Its work focuses on direct-to-chip liquid cooling for processors and other electronic components. CAEPlus is developing DirectActiveCool, an active thermal management system for computing and data center equipment. The company also identifies HVAC and electric vehicle systems as applications for its cooling technology. Its engineering work includes heat transfer, thermal management, mechanical design, simulation and cooling system development. CAEPlus works with organizations developing computing hardware, data center infrastructure and other systems requiring thermal management. The company is working with prospective customers and partners on commercial applications.
