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Qualcomm Launches Dragonwing IQ-X Processors

by | Nov 18, 2025

Introduces a processor platform that integrates compute, AI acceleration, industrial connectivity and software support to run control, automation and edge workloads across factory systems
Image: Qualcomm

SAN DIEGO, CA, Nov 18, 2025 – Qualcomm has launched the Dragonwing IQ-X Series, a processor line for industrial computers and control hardware, including PLCs, HMIs, edge controllers, panel PCs, and box PCs. The chips are built for harsh environments and include standard interfaces that make it easier to connect with existing industrial machines. They also support multimedia features and maintain low power use.

“With the Dragonwing IQ‑X Series, we’re bringing the Qualcomm Oryon CPU’s best-in-class single and multithread performance to the heart of the industrial PC, enabling smarter factories, more capable and faster edge controllers on the factory floor,” stated Nakul Duggal, group general manager, automotive and industrial & embedded IoT, Qualcomm Technologies. “The Dragonwing IQ‑X Series gives OEMs and ODMs a superior platform to build on for years while reducing complexity and reducing time to market.”

Helping to Meet the Demands of Modern Industry

The Dragonwing IQ-X Series address the needs of industrial OEMs and ODMs, delivering single and multithread compute performance, life-cycle support, superior security features, connectivity and power efficiency. At its core is the Qualcomm Oryon CPU, the processor built on 4nm process technology, offering configurations from 8 to 12 high-performance cores and up to 45 TOPS of AI performance. The Dragonwing IQ-X series supports temperature range (-40°C to 105°C) for use in challenging environments.

The Dragonwing IQ-X Series supports COM module form factors, allowing it to replace existing modules on current carrier boards. An evaluation kit is also available for testing and development. The platform works with standard hardware peripherals and bridge chips, which helps manufacturers use it with existing hardware. It supports Windows 11 IoT Enterprise LTSC and can run software including Qt, CODESYS, and EtherCAT.

Industrial systems can use the NPU to run AI applications through the Qualcomm AI software stack and runtimes such as ONNX and PyTorch. The Dragonwing IQ-X series support AI models for tasks such as predictive maintenance, condition-based monitoring, and defect detection. They also simplify moving existing models to edge devices and developing new applications for factory use. The Dragonwing IQ-X Series provides a practical base for deploying AI at the industrial edge.

Accelerating Time-to-Market for OEMs and ODMs

The Dragonwing IQ-X Series is built for customization and industrial designs. It reduces component counts by removing separate AI and multimedia modules, reducing system complexity in rugged deployments. Its flexible architecture and long-term availability help OEMs and ODMs build configurable, rugged platforms for factory automation, robotics, and edge computing. OEMs like Advantech, congatec, NEXCOM, Portwell, SECO, and Tria are among the first to adopt the platform, with commercial devices expected to be announced in the coming months.

Source: Qualcomm

About Qualcomm

Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, is a leading American semiconductor and wireless technology company headquartered in San Diego, CA. Established in 1985, the company specializes in designing and supplying integrated circuits and system software for wireless telecommunications. Its product portfolio includes Snapdragon processors, modems, and platforms utilized in smartphones, automotive systems, Internet of Things (IoT) devices, and industrial equipment. Qualcomm operates primarily through two segments: Qualcomm CDMA Technologies (QCT), which focuses on semiconductor products, and Qualcomm Technology Licensing (QTL), which manages its patent portfolio. The company serves a global clientele across various industries, including mobile, automotive, computing, and industrial sectors, leveraging its expertise in 5G, AI and low-power computing to drive innovation and connectivity worldwide.