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Rapidus Names Design Partners for Rapidus CORE Initiative

by | Oct 6, 2026

Design Solution Associates will connect customers with Rapidus for chip development, with EDA and IP partnerships planned under the broader CORE framework.

TOKYO, Japan, Oct 6, 2026 – Rapidus Corporation will establish a global semiconductor development framework, with 17 design companies participating in its first initiative. The Rapidus Collaborative Open Rapid Ecosystem (CORE) will support chip development and production for customers in Japan and overseas.

The first group, Design Solution Associates, will connect customers with Rapidus and provide participating companies’ design resources. The initiative will support customer projects from design through manufacturing.

The 17 participating companies are: AION Silicon Limited; Cadence Design Systems, Inc.; Dai Nippon Printing Co., Ltd.; GreatAsic Technology Sdn. Bhd.; HCL Technologies Limited; Infinecs Systems Sdn. Bhd.; Infosys Limited; MavissDesign Co., Ltd.; MosChip Technologies Limited; NSW Inc.; Oppstar Technology Sdn Bhd; Quest Global Services Pte. Ltd.; SkyeChip Berhad; Synopsys, Inc.; TOPPAN Inc.; Toshiba Information Systems (Japan) Corporation; and Wipro Limited.

Rapidus plans to expand CORE beyond design to include EDA, IP and other categories through partnerships with companies in those areas.

Source: Rapidus

About Rapidus Corporation

Rapidus Corp. is a semiconductor foundry based in Tokyo, Japan. Founded in August 2022, the company develops and manufactures logic semiconductors and integrated circuits. Its model combines chip design and manufacturing work with AI-based tools intended to shorten development cycles. Rapidus is backed by Japanese companies including Toyota, Sony and NEC, as well as government funding. The company has said it plans pilot production of 2-nanometer gate-all-around transistors, with mass production scheduled for 2027. Its chips are intended for use in AI, data centers, industrial systems, automotive systems and autonomous platforms.