TOKYO, Japan, Aug 3, 2026 – Renesas Electronics has introduced its third-generation (Gen 3) DDR5 Multiplexed Rank Dual In‑Line Memory Module (MRDIMM) chipset, supporting server memory speeds up to 16,000 mega transfers per second (MT/s). The Gen 3 design provides 25% more memory bandwidth than its predecessor while using existing DDR5 infrastructure for AI data centers, cloud systems and accelerated computing workloads.
The chipset includes the RRG5013 Multiplexed Registering Clock Driver and RRG5103 Multiplexed Data Buffer. The components support next-generation MRDIMM performance while retaining the standard DIMM form factor and system compatibility with Gen 2.
Renesas also supplies power management integrated circuits, Serial Presence Detect hubs and temperature sensors for the MRDIMM platform.
Gen 3 adds Device Equalization Self-Train Mode Quality Indication Status. The function provides data that users can apply when adjusting timing and receiver equalization training margins.
The chipset also accounts for system-level power and thermal constraints as memory bandwidth increases. Renesas will provide detailed power comparisons in its product documentation.
“AMD has a long history of supporting open, standards-based technologies that power data center innovation and deliver greater flexibility as AI and HPC workloads continue to evolve,” said Amit Goel, corporate vice president, compute and enterprise AI platform solutions engineering, AMD. “Innovations in next-generation memory form factors such as MRDIMM and Renesas’ chipset are important to helping the industry deliver higher bandwidth, greater efficiency and continued platform scalability.”
“AI training and inferencing workloads are fundamentally reshaping system memory requirements for data center infrastructure,” said Sameer Kuppahalli, vice president and general manager, memory interface division at Renesas. “To meet the insatiable appetite of these workloads for memory capacity and throughput, Renesas continues to lead the industry by delivering our 3rd generation of chipset components for MRDIMM. Our customers employ Renesas’ complete chipset components in order to further push the frontiers of memory throughput and capacity.”
Availability
Renesas will demonstrate the RRG5013, RRG5103 and other Gen 3 MRDIMM interface components at FMS 2026, the Future of Memory and Storage Conference. The event runs Aug. 4-6, 2026, in Santa Clara, CA (#807).
Source: Renesas Electronics
About Renesas Electronics
Renesas Electronics is a semiconductor manufacturer that develops and supplies microcontrollers, analog devices, power semiconductors, system-on-chip products, and connectivity components used in embedded systems. The company provides semiconductor devices and related software for automotive systems, industrial equipment, infrastructure, consumer electronics, and IoT applications. Renesas serves automotive suppliers, electronics manufacturers, device makers, and industrial system developers worldwide. The company designs, manufactures, and markets semiconductor components used in control systems, sensing, power management, and communications. Renesas Electronics was formed in 2010 through the merger of Renesas Technology and NEC Electronics, building on semiconductor businesses of Hitachi and Mitsubishi Electric. The company is headquartered in Tokyo, Japan. Renesas operates design centers, manufacturing facilities, and sales offices across Asia, Europe, and the Americas. Renesas Electronics employs about 23,000 people worldwide.
