TOKYO, Japan, July 29, 2025 – Renesas has introduced the RZ/G3E, a 64-bit microprocessor (MPU) built to handle AI workloads and real-time Human Machine Interface (HMI) tasks at the edge. With a quad-core Arm Cortex-A55, integrated Neural Processing Unit (NPU), and HD dual-display support, the chip targets industrial and consumer systems that require fast local processing, HD graphics, and high-speed connectivity. Designed for applications like factory equipment, medical monitors, retail terminals and building automation, the RZ/G3E enables performance scaling without cloud dependence.
High-Performance Edge Computing and HMI Capabilities
The RZ/G3E features a quad-core Arm Cortex-A55 processor, a Cortex-M33 core, and the Ethos-U55 NPU for handling AI workloads. This configuration supports applications such as image and object recognition, voice processing, and anomaly detection with while minimizing main CPU load. Designed for HMI usage, it supports Full HD (1920×1080) video at 60fps on two separate displays, utilizing LVDS (dual-link), MIPI-DSI, and parallel RGB output interfaces. The device also includes a MIPI-CSI camera interface for video input and sensing applications.
“The RZ/G3E builds on the proven performance of the RZ/G series with the addition of an NPU to support AI processing,” said Daryl Khoo, vice president of embedded processing at Renesas. “By using the same Ethos-U55 NPU as our recently announced RA8P1 microcontroller, we’re expanding our AI embedded processor portfolio and offering a scalable path forward for AI development. These advancements address the demands of next-generation HMI applications across vision, voice and real-time analytics with powerful AI capabilities.”
The RZ/G3E offers communication interfaces suited for edge devices. It includes PCI Express 3.0 (2 lanes) for data rates up to 8Gbps, USB 3.2 Gen2 for 10 Gbps data transfer, and dual-channel gigabit ethernet to support connections with cloud services, storage systems, and 5G modules.
Low-Power Standby with Fast Linux Resume
From the third-generation RZ/G3S onward, the RZ/G series incorporates power management features to reduce standby power. The RZ/G3E supports sub-CPU operation and peripheral functions while keeping power use near 50 mW, dropping to about 1 mW in deep standby mode. It enables DDR self-refresh to retain memory data, allowing the system to wake from deep standby and resume Linux applications.
Comprehensive Linux Software Support
Renesas continues to offer the Verified Linux Package (VLP) based on the civil infrastructure platform, with over 10 years of maintenance support. For users requiring the latest versions, Renesas provides Linux BSP plus, including support for the LTS Linux kernel and Yocto. Ubuntu by Canonical and Debian open-source OS are also available for server or desktop Linux environments.
Key Features of RZ/G3E
- CPU: Quad-core Cortex-A55 (up to 1.8GHz), Cortex-M33
- NPU: Ethos-U55 (512 GOPS)
- HMI: Dual Full HD output, MIPI-DSI / Dual-link LVDS / Parallel RGB, 3D graphics, H.264/H.265 codec
- Memory Interface: 32-bit LPDDR4/LPDDR4X with ECC
- Connectivity for 5G Communication: PCIe 3.0 (2 lanes), USB 3.2 Gen2, USB 2.0 x2, Gigabit Ethernet x2, CAN-FD
- Operating Temperature: -40°C to 125°C
- Package Options: 15mm square 529-pin FCBGA, 21mm square 625-pin FCBGA
- Product Longevity: 15-year supply under Product Longevity Program (PLP)
System-on-Module Solutions from Renesas and Ecosystem Partners
Renesas has introduced system-on-module (SoM) solutions featuring the RZ/G3E. A range of SoM solutions will be available from Renesas’ ecosystem partners such as a SMARC module from Tria, an OSM (Size-M) from ARIES Embedded, and an OSM (Size-L) from MXT.
Winning Combinations
Renesas has integrated the RZ/G3E with compatible components to develop Full HD Dual-Display HMI Platform and Digital Otoscope solutions. These Winning Combinations are vetted system architectures which use mutually compatible devices to support optimized, low-risk designs and reduce time to market. Renesas provides more than 400 Winning Combinations, using products from its portfolio to help customers streamline development and accelerate product launches.
Availability
The RZ/G3E is available along with the evaluation board kit. The kit includes a SMARC v2.1.1 module board and a carrier board.
Source: Renesas
About Renesas Electronics Corporation
Renesas Electronics Corporation, headquartered in Tokyo, Japan, is a semiconductor manufacturer focused on the research, design, development, production, and sale of semiconductor components. Its product portfolio includes microcontrollers, analog and power devices, and system-on-chip (SoC) solutions, which are used across automotive, industrial, infrastructure, and IoT applications. As of December 31, 2024, the company employed approximately 21,204 people globally. For the fiscal year ending December 31, 2024, Renesas reported revenue of ¥1,348.5 billion and an operating profit of ¥223.0 billion.