TOKYO, Japan, Apr 6, 2026 – Renesas Electronics said its radiation-hardened (rad-hard) ICs are used in NASA’s Artemis II mission, launched April 1 from Kennedy Space Center in Florida, where onboard systems must operate under high-radiation conditions. The mission, the first crewed flight around the Moon in decades, is part of NASA’s program to return humans to the lunar surface.
Four astronauts are now en route to orbit the Moon aboard NASA’s Orion spacecraft as part of the Artemis II mission. During the flight, the crew will test spacecraft systems and crew operations in deep space before returning to Earth. The mission is expected to verify key capabilities needed for future crewed missions and lunar landings.
The rad-hard ICs of Renesas Electronics are used across multiple subsystems in the Orion capsule and Space Launch System (SLS) rocket. The Intersil-branded devices are integrated into avionics and launch safety systems, where they regulate and distribute power, maintain signal transmission, and support onboard computing. They are built to operate under high radiation and extreme temperature conditions typical of space missions.
“Human space flight missions leave no margin for failure, and we’re proud to be one of the select few semiconductor companies entrusted to provide space-qualified technology for this historic crewed Artemis mission,” said Chris Stephens, vice president of the HiRel business division at Renesas. “Our rad-hard devices help keep spacecraft systems connected, protected and precisely controlled, as crews venture into deep space. We look forward to supporting future landmark missions and ushering in the next era of solar system exploration with our space‑grade semiconductor solutions.”
Renesas traces its Intersil brand back more than six decades to Radiation Inc., founded in 1950. Renesas manufactures rad-hard ICs, including SMD devices, to MIL-STD-883 and MIL-PRF-38535 Class V/Q standards for defense and high-reliability (Hi-Rel) applications. These devices support subsystems for data communications, power supply and conditioning, protection circuits, and telemetry, tracking, and control (TT&C).
Source: Renesas Electronics
About Renesas Electronics
Renesas Electronics is a semiconductor manufacturer that develops and supplies microcontrollers, analog devices, power semiconductors, system-on-chip products, and connectivity components used in embedded systems. The company provides semiconductor devices and related software for automotive systems, industrial equipment, infrastructure, consumer electronics, and IoT applications. Renesas serves automotive suppliers, electronics manufacturers, device makers, and industrial system developers worldwide. The company designs, manufactures, and markets semiconductor components used in control systems, sensing, power management, and communications. Renesas Electronics was formed in 2010 through the merger of Renesas Technology and NEC Electronics, building on semiconductor businesses of Hitachi and Mitsubishi Electric. The company is headquartered in Tokyo, Japan. Renesas operates design centers, manufacturing facilities, and sales offices across Asia, Europe, and the Americas. Renesas Electronics employs about 23,000 people worldwide.