PLANO, TX, Sep 28, 2026 – Siemens and TSMC have developed an AI agent to identify, analyze and fix design rule violations in digital and custom integrated circuits. The workflow combines Siemens’ Calibre software with Aprisa AI and Solido Fuse technologies.
The work forms part of the companies’ collaboration within TSMC’s Open Innovation Platform (OIP). It also covers process-node certifications, 3D chip integration, thermal analysis and optical interconnect design.
“Our continued collaboration with TSMC exemplifies Siemens’ commitment to delivering AI-driven automation and advanced semiconductor design capabilities that help customers innovate at the industry’s most advanced process nodes,” said Ankur Gupta, executive vice president, EDA IC Software, Siemens Digital Industries Software. “By combining Siemens’ EDA portfolio with TSMC’s leading process and packaging technologies, we are helping customers achieve new levels of productivity, speed and design confidence.”
“AI presents a significant opportunity to drive productivity and efficiency across increasingly complex semiconductor design workflows,” said Aveek Sarkar, director of the ecosystem and alliance management division at TSMC. “Our collaboration with OIP partners like Siemens focuses on delivering intelligent, trusted automation that empowers engineers to navigate rising design complexity while achieving stringent performance and energy-efficiency targets. By integrating AI into critical stages of the design process, we enable mutual customers to leverage TSMC’s industry-leading processes and advanced packaging technologies to accelerate the expansion of AI innovation.”
AI-Based Design Automation
Siemens and TSMC are developing autonomous workflows using the Fuse EDA AI System and Fuse EDA AI Agent. These workflows coordinate multistep tasks across electronic design automation (EDA) tools and validate results during execution.
Fuse EDA AI Agent incorporates NVIDIA AI technologies. Those technologies improve token efficiency, reasoning and execution during long-running engineering tasks.
The automated design rule check (DRC) fixing workflow builds on Calibre Check Assist capability. That capability supplies contextual guidance and design rule information during debugging. The collaboration also includes custom IC design automation through Solido Fuse and place-and-route and digital implementation automation through Aprisa.
3D Chip Integration and Thermal Analysis
Siemens has introduced multi-machine support in Calibre 3DStack Advanced for inter-chiplet antenna verification using TSMC 3DFabric technologies. The capability supports TSMC-SoIC, a wafer-level 3D chip-stacking technology. Certification work for chip-on-wafer-on-substrate with local silicon interconnect (CoWoS-L) remains underway.
Siemens also reports performance improvements in the Interface Check Flow for TSMC-SoW. Solido Simulation Suite, Calibre xACT and Calibre 3DThermal support additional 3D IC and multiphysics design work involving packaging and silicon photonics. Calibre 3DThermal has received certification for static and transient thermal analysis on TSMC A16 technology. Siemens has also completed support for the system-on-wafer thermal reference flow.
The companies continue developing 3Dblox support, including chip-package co-design workflows. They are also developing Aprisa capabilities for die-to-die automatic routing based on pre-simulation results. Those capabilities derive routing configurations intended to meet signal integrity specifications.
Silicon Photonics Design
Siemens’ tools support the design, implementation and verification of features for TSMC-COUPE (Compact Universal Photonic Engine). Joint development uses Innovator3D IC Integrator, Calibre 3DStack, Solido Simulation Suite, L-Edit and Calibre Interactive. Solido Simulation Suite also supports four-level pulse amplitude modulation (PAM4) measurements for optical transceiver interfaces associated with TSMC-COUPE.
Work on the TSMC-COUPE thermal reference flow remains in progress. The companies are also continuing joint validation of Calibre 3DThermal for TSMC-COUPE.
Process-Node Certifications
Calibre nmDRC, Calibre nmLVS, Calibre xACT and Calibre PERC have received certification for TSMC’s A14 process. Solido Simulation Suite is certified for SPICE accuracy on TSMC N3C, A16 and A14 technologies for analog, radio-frequency and memory verification. Within TSMC’s custom design reference flow, Siemens supports simulations that account for IC aging, real-time self-heating and safe operating area checks.
The collaboration also includes Solido Design Environment for variation-aware verification and automated cell optimization.
Siemens’ mPower software is certified for transistor-level IR-drop and electromigration analysis on TSMC N2P for digital and analog designs. It also holds certification for analog analysis on N3C. Siemens and TSMC continue working on N2 and N3 custom design reference flows for electromigration and IR-drop analysis.
A14 certification activities remain underway for Aprisa and mPower analog software.
Design Training
Siemens Xcelerator Academy provides its EDA learning resources to TSMC Design Center Alliance partners, alongside mutual customers. The program offers self-paced, on-demand training.
Siemens recently released an end-to-end digital implementation flow lab tutorial based on TSMC’s 5nm process technology.
Source: Siemens
About Siemens Digital Industries Software
Siemens Digital Industries Software, a business unit of Siemens AG, provides industrial software, hardware and related services through the Siemens Xcelerator platform. The company’s portfolio includes product lifecycle management, electronic design automation, simulation and digital twin tools, manufacturing operations management and low-code application development. These products support design, engineering and production workflows across sectors such as aerospace and defense, automotive, electronics and semiconductors, machinery, medical devices and process manufacturing. Siemens Digital Industries Software traces its origins to 1963 as United Computing, later becoming Siemens PLM Software in 2007 before adopting its current name. It supplies technologies that help organizations manage product, process data, and improve development and manufacturing efficiency across a range of industrial applications.
About TSMC
Taiwan Semiconductor Manufacturing Co. (TSMC) is a semiconductor foundry based in Hsinchu, Taiwan. Founded in 1987, the company manufactures chips for customers that design but do not produce semiconductors in their own fabs. TSMC produces semiconductor components using process technologies that include 5-nanometer and 3-nanometer nodes, with 2-nanometer production planned. Its customers serve consumer electronics, computing, automotive, networking and industrial markets. Technology companies use TSMC manufacturing capacity for chips used in smartphones, data centers, AI systems and autonomous vehicles. TSMC employs about 84,000 people worldwide. The company served 530 customers and manufactured about 12,000 products for various applications.
