PLANO, TX, Feb 24, 2026 – Siemens has won in the “Packaging: Design” category at the 2026 Chiplet Summit Best of Show Awards for its Innovator3D IC solution. The platform enables pathfinding, planning, and heterogeneous integration of ASICs and chiplets. It supports advanced 2.5D and 3D packaging technologies used in chiplet-based semiconductor design.
The award was presented at the fourth annual Chiplet Summit at the Santa Clara convention center. Chiplet Summit, organized by Semper Technologies, brings together engineers and technologists working on chiplet architectures. The event focuses on practical design and packaging challenges across semiconductor applications.
“The recognition of Innovator3D IC at Chiplet Summit reinforces our mission to deliver cutting edges technologies that radically accelerate how our customers are developing the next generation semiconductors,” said AJ Incorvaia, senior vice president, Electronic Board Systems, Siemens Digital Industries Software. “With Innovator3D IC, we are delivering a true system-level design approach where heterogeneous dies, chiplets, interposers and packages are optimized and validated within a single unified flow.”
“Siemens’ Innovator3D IC stands out for its combination of design lifecycle coverage and breadth of industry-standard data models,” said Chuck Sobey, general chair, Chiplet Summit. “As multi-die integration grows more complex, this solution gives designers the tools to move faster and innovate with confidence. We congratulate Siemens EDA on this well-deserved recognition.”
Source: Siemens
About Siemens Digital Industries Software
Siemens Digital Industries Software, a business unit of Siemens AG, provides industrial software, hardware and related services through the Siemens Xcelerator platform. The company’s portfolio includes product lifecycle management, electronic design automation, simulation and digital twin tools, manufacturing operations management and low-code application development. These products support design, engineering and production workflows across sectors such as aerospace and defense, automotive, electronics and semiconductors, machinery, medical devices and process manufacturing. Siemens Digital Industries Software traces its origins to 1963 as United Computing, later becoming Siemens PLM Software in 2007 before adopting its current name. It supplies technologies that help organizations manage product, process data, and improve development and manufacturing efficiency across a range of industrial applications.
About Chiplet Summit
Chiplet Summit is a technical conference focused on chiplet-based semiconductor design and packaging. The event brings together engineers, designers, researchers and executives from semiconductor, hardware and electronic design automation industries. Attendees discuss multi-die integration, high-bandwidth memory, die-to-die interfaces and packaging methods. The program includes keynotes, technical sessions, tutorials, panel discussions and exhibits from tool vendors and chip developers. Chiplet Summit launched its first event in 2023. It is organized by Semper Technologies, headquartered in Santa Clara, CA. The conference serves professionals working in processor, memory, communications and AI device development. Participating companies develop chiplet architectures, packaging technologies and related design tools.