GENEVA, Switzerland, June 1, 2026 – STMicroelectronics has introduced 700V gallium nitride (GaN) power semiconductors for power supplies used in AI servers, industrial systems and grid infrastructure, targeting applications that are pushing beyond the efficiency and power-density limits of silicon devices. The new PowerGaN devices join the STPOWER portfolio for high-voltage, high-frequency power conversion.
The semiconductors support high-power operation and higher-frequency topologies. Their GaN design provides low conduction losses, low switching losses at high frequencies and zero reverse-recovery charge.
These characteristics can reduce system size, weight and temperature. ST positions the devices for use in AI server power supplies, robotics, industrial power supplies and smart-grid converters used in energy generation, distribution and storage.
“Broadening our PowerGaN portfolio with new 700V devices extends the benefits of gallium-nitride technology into medium-power and high-power applications,” said Mario Aleo, executive vice president, power & discrete sub-group, STMicroelectronics. “We will continue to expand the portfolio with additional voltage ratings and features, reinforcing our commitment to GaN for tomorrow’s AI servers, humanoid robotics, industrial power, and advanced consumer power applications including home appliances.”
The new PowerGaN devices add GaN enhancement-mode transistors (HEMTs) to ST’s portfolio.
Their key features include:
- Low on-resistance range – The devices offer RDS(on) values from 53 mΩ to 270 mΩ.
- Low capacitance and gate charge – The semiconductors use GaN wide-bandgap properties to provide low internal capacitance and gate charge, improving switching behavior at high frequencies.
- Stronger efficiency metric than silicon – Each device has a Qg x RDS(on) figure of merit ahead of traditional silicon devices.
- MOSFET replacement option – The PowerGaN devices can be used in power-conversion circuits as replacements for MOSFETs, depending on the design requirements.
- Support for higher-frequency topologies – The devices can operate at elevated switching frequencies, reducing the size of magnetics and passive components.
- Compact power stage – Higher-frequency operation can help reduce component size, supporting a compact power stage and power density.
- Surface-mount package options – The devices are available in DPAK, TO-LL and PowerFLAT packages, which are supported by electronic design automation libraries and toolchains.
- Kelvin source connection – The TO-LL and PowerFLAT versions include a Kelvin source connection that separates the gate-control circuit from the main power path. This improves noise immunity, protects the gate driver and preserves timing margin.
- Thermal package designs – The TO-LL package uses thermally efficient drain and source connections, while the PowerFLAT 8×8 package includes a solderable source pad for enhanced thermal performance.
Source: STMicroelectronics
About STMicroelectronics
STMicroelectronics (ST) is a semiconductor company founded in 1987. It designs and manufactures microcontrollers, sensors, power devices and other analog and mixed-signal components. The company operates as an integrated device manufacturer with in-house production that supports large-volume supply for global markets. Its customers include automotive, industrial, consumer electronics and communications equipment manufacturers. ST also works with technology partners to develop components used in mobility systems, energy and power management equipment and connected devices. The company reports ongoing efforts to reduce emissions across its operations and increase the share of renewable electricity in its manufacturing sites, with a goal to reach full renewable sourcing by 2027. ST is headquartered in Geneva, Switzerland. It serves more than 200,000 customers worldwide and employs about 50,000 people. Its technologies support applications that require efficient power conversion, sensing, processing and connectivity. The company expands its portfolio to support automotive, industrial, consumer and connected system applications through integrated design and manufacturing.