GENEVA, Switzerland, June 23, 2026 – STMicroelectronics’ VL53L9 adds direct Time-of-Flight 3D LiDAR depth sensing to low-compute edge AI systems built around small microcontrollers. The module provides AI-ready output data for robotics, industrial automation, smart buildings, AR/VR, consumer electronics and healthcare applications, targeting designs where system size, processing overhead and integration complexity are limiting factors.
“VL53L9 demonstrates how far Time-of-Flight sensing has evolved, combining high-resolution depth data, up to 100 frames per second, and a fully integrated architecture in a single compact module. By simplifying integration and reducing system complexity, we enable customers to accelerate the development of applications such as robotics, smart infrastructure, and healthcare monitoring,” said Alexandre Balmefrezol, executive vice president and general manager of the Imaging sub-group at STMicroelectronics. “This launch reflects our strategy to move beyond standalone sensors and deliver integrated sensing systems that support real-world edge AI.”
“3D sensing demand accelerates across robotics, industrial automation, XR, and intelligent consumer devices. Time-of-Flight technology is expanding beyond smartphones into applications requiring compact, affordable, and precise depth perception, from navigation and people monitoring to gesture recognition and safety. Higher resolution multizone dToF modules are now emerging as key enablers for this next wave of 3D sensing adoption (1),” said Anas Chalak, market & technology analyst at Yole Group.
Target Applications
ST positions the FlightSense VL53L9 for application areas:
- Robotics: small-object detection, simultaneous localization and mapping, and obstacle avoidance for autonomous navigation.
- Industrial automation: volume measurement in tanks and bins to support inventory management and operations.
- Smart buildings and homes: human presence detection and people counting while preserving user privacy.
- AR/VR and consumer electronics: gesture recognition, body tracking and finger skeleton applications.
- Healthcare: fall detection and monitoring systems for eldercare and patient safety.
Technical Information
Depth Sensing Performance
The VL53L9 provides 2,268 resolution zones, arranged as 54 × 42, with a 54° × 42° field of view for 3D depth mapping and detection of small objects, contours and edges.
The module uses BSI SPAD sensor technology and meta-surface optical elements. It supports ranging from less than 5 cm up to 9 meters, with up to 1% accuracy and a frame rate of 100 frames/second.
Illumination and Processing Architecture
The module uses dual-scan flood illumination instead of dot scanning. This approach:
- reduces motion artifacts;
- eliminates dead zones;
- improves small-object detection;
- captures 2D infrared and 3D depth images.
The architecture is designed to simplify post-processing and support edge AI workloads on small MCUs with low compute requirements.
The VL53L9 integrates on-chip dToF processing and a dedicated power management IC. It is calibration-free, which simplifies integration and reduces system cost and complexity.
Module Design and Interfaces
The module measures 12.8 mm × 6.1 mm × 4.6 mm and is supplied as a reflowable, single-component device compatible with a range of cover glass materials. It supports dual power supply operation at 1.2 V and 3.3 V and outputs data through MIPI or I3C interfaces for compatibility with different CPU architectures. The module is certified as Class 1 laser safe.
Availability
ST FlightSense VL53L9 will be mass produced from early July 2026
(1) 2025 – 2030 period; Source: 3D Imaging & Sensing 2025 report, Yole Group
Source: STMicroelectronics
About STMicroelectronics
STMicroelectronics (ST) is a semiconductor company founded in 1987. It designs and manufactures microcontrollers, sensors, power devices and other analog and mixed-signal components. The company operates as an integrated device manufacturer with in-house production that supports large-volume supply for global markets. Its customers include automotive, industrial, consumer electronics and communications equipment manufacturers. ST also works with technology partners to develop components used in mobility systems, energy and power management equipment and connected devices. The company reports ongoing efforts to reduce emissions across its operations and increase the share of renewable electricity in its manufacturing sites, with a goal to reach full renewable sourcing by 2027. ST is headquartered in Geneva, Switzerland. It serves more than 200,000 customers worldwide and employs about 50,000 people. Its technologies support applications that require efficient power conversion, sensing, processing and connectivity. The company expands its portfolio to support automotive, industrial, consumer and connected system applications through integrated design and manufacturing.