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Synopsys Launches Multiphysics Fusion for Advanced Chip Design

by | Jun 18, 2026

Multiphysics Fusion links EDA, timing signoff, thermal analysis and multi-die workflows for advanced semiconductors
Synopsys multiphysics fusion solutions. Image: Synopsys

SUNNYVALE, CA, June 18, 2026 – Synopsys’ first Multiphysics Fusion solutions are available for customer deployment, integrating its AI-powered EDA tools with Ansys signoff analysis for timing signoff, design closure, multi-die design, and analog workflows.

The portfolio addresses constraints in advanced-node and multi-die chip design, including signal integrity, power integrity, thermal integrity, electromagnetic effects, and co-packaged optics. Synopsys said these factors are becoming more critical as chip complexity increases, requiring closer integration between EDA and multiphysics analysis.

“Multiphysics is fundamentally reshaping how advanced semiconductor designs are engineered, driving a shift from costly overdesign to integrated, system-aware co-design,” said Sanjay Bali, senior vice president of EDA product management and strategy at Synopsys. “Our Multiphysics Fusion portfolio unifies Synopsys and Ansys technologies to embed physics directly into digital and analog workflows, enabling engineering teams to design across domains with fewer iterations, improved productivity and more optimized silicon for next-generation systems.”

Multiphysics-Aware Co-Design Across the Chip Design Flow

Image: Synopsys

The first Multiphysics Fusion solutions build on the approach Synopsys introduced at Converge 2026. The portfolio includes GPU-accelerated flows powered by NVIDIA CUDA-X libraries, including cuDSS:

  • Multiphysics Fusion for Timing Signoff: Integrates Synopsys PrimeTime with RedHawk-SC and RedHawk-SC Electrothermal, along with RC extraction using Synopsys StarRC and multiphysics HFSS-IC. The flow incorporates IR, thermal, and stress effects to improve margins and reduce IR-induced timing escapes.
  • Multiphysics Fusion for Design Closure: Combines Synopsys PrimeClosure with RedHawk-SC to embed power integrity into golden signoff optimization. The flow can deliver up to 10x faster design closure, higher engineering change order success rates, and improved power, performance, and area.
  • Multiphysics Fusion for Multi-die Designs: Combines the Synopsys 3DIC Compiler platform with RedHawk-SC, RedHawk-SC Electrothermal, and multiphysics HFSS-IC for concurrent power integrity, thermal, and electromagnetic analysis. The solution is designed to provide system-level insight from exploration through golden signoff with correct-by-construction design.
  • Multiphysics Fusion for Analog & Photonic Design: Integrates Synopsys Custom Compiler with multiphysics HFSS-IC for on-chip electromagnetic analysis in the analog design flow. It also combines Synopsys OptoCompiler with Lumerical for photonic IC and optics systems.
Image: Synopsys

Demonstrating Impact with Market Leaders

Engagements with semiconductor companies validate the value of Multiphysics Fusion solutions:

“As multi-die integration becomes increasingly important for high performance compute platforms, it’s critical we make the right system-level design decisions early in the development process,” said Harrison Hsieh, vice president at MediaTek. “By unifying multiphysics analysis and timing signoff across digital, analog, photonic and multi-die designs, Synopsys Multiphysics Fusion technology gives us earlier insight into cross-domain interactions across silicon, advanced packaging and optical domains, which makes it possible for us to improve predictability, reduce late-stage rework, and achieve a runtime that’s 10 times faster than before.”

“Advanced AI and high-performance computing platforms are pushing chip design beyond traditional workflows, and to deliver greater performance, efficiency and reliability at scale, multiphysics-aware co-design is essential,” said Tim Costa, vice president and general manager of computational engineering at NVIDIA. “Synopsys is using NVIDIA accelerated computing and CUDA-X libraries, including cuDSS, which delivers up to 13x GPU acceleration, to scale increasingly complex SPICE simulations, electromagnetics, and power-integrity workloads. In addition, Synopsys Multiphysics Fusion solutions enable up to 5x faster design closure and up to 86% IR fix rates in selected pilot designs.”

“Accurate timing signoff at advanced nodes requires a unified approach that accounts for IR drop, thermal, and stress effects directly within timing analysis,” said Hyung-Ock Kim, vice president and head of the Foundry Design Technology Team at Samsung Electronics. “Synopsys’ Multiphysics Fusion technology provides a unified, all‑aware timing signoff platform by integrating PrimeTime with multiphysics insight, delivering SPICE-accurate correlation and enabling margin recovery. This is increasingly important as we pursue higher levels of integration, performance, and reliability across advanced process and multi‑die technologies.”

In addition, the Cisco Silicon One group is leveraging Synopsys Multiphysics Fusion technology to unify IR drop effects within signoff design closure to gain earlier, more accurate visibility into real-world conditions. Combined with signoff-accurate, timing-aware IR fixing, this enables predictive optimization – helping Cisco Silicon One converge on power integrity issues faster, deliver better PPA, and achieve significantly faster runtime.

Image: Synopsys

Availability

Multiphysics Fusion solutions for timing signoff, design closure, multi-die design, and analog and photonic design are available as of date.

Source: Synopsys

About Synopsys

Synopsys Inc. is a U.S. software and semiconductor technology company founded in 1986. The company develops electronic design automation software, semiconductor intellectual property, and verification tools used to design and test integrated circuits. Its products help engineers design, simulate, verify, and manage semiconductor chips and electronic systems. Synopsys also provides software security testing and engineering analysis tools through internal development and acquisitions. The company serves semiconductor manufacturers, electronics companies, system integrators, and software developers. Its customers operate in industries such as semiconductors, automotive, aerospace, consumer electronics, telecommunications, and data centers. Synopsys is headquartered in Sunnyvale, CA. The company employs about 28,000 people worldwide and serves customers across global technology sectors. Synopsys operates offices across North America, Europe, and Asia.