MANNHEIM, Germany, June 2, 2026 – EXTOLL has introduced an integrated UCIe IP package for GlobalFoundries’ FDX technology, combining its PHY with Chip Interfaces’ D2D Adapter. The package brings UCIe 2.0-based die-to-die connectivity to mainstream semiconductor nodes.
The pre-integrated and co-verified IP is designed for standard packaging and supports organic substrates across UCIe-defined bump pitch ranges. It is also verified for interoperability, allowing semiconductor developers to build chiplet-based systems on GF’s FDX technology.
“Building on a highly successful collaboration with Chip Interfaces and GlobalFoundries, we are thrilled to bring our customers a powerful, timely solution that accelerates and simplifies their transition to chiplet-based systems, unleashing new levels of innovation and performance.”, says Dirk Wieberneit, CEO of EXTOLL. “By combining the exceptional mixed-signal performance of GF’s FDX technology with EXTOLL’s leading-edge UCIe IP, we’re delivering real solutions for optimized chiplet-based systems that can evolve with the growing demand for faster, reliable and more secure connectivity.”
The IP is optimized for standard packaging, with full support for organic substrates across standard-defined bump pitch ranges. Designed and rigorously verified for interoperability, it empowers customers to develop differentiated systems based on the UCIe v2.0 standard.
The D2D Adapter operates between protocol components and the UCIe PHY. It transfers data across the UCIe link while minimizing main data path logic for low-latency flit transport. The adapter also supports ARB/MUX functions for multiple simultaneous protocols, including CXL.
“The D2D Adapter for UCIe combined with the UCIe PHY form a complete UCIe solution ready to support any protocol layer. The offering consists of two IP parts the D2D adapter from Chip Interfaces and the UCIe PHY from Extoll”, says Anne Voss Winther, CEO of Chip Interfaces.” “Chip Interfaces is happy to partner with Extoll on UCIe technology to create a complete solution for our customers.”
GlobalFoundries’ FDX technology combines RF and mixed-signal functions, power efficiency and full system-on-chip integration. The process includes Auto Grade 1 qualification, embedded nonvolatile memory options and radiation-hardness by design. GlobalFoundries manufactures FDX at facilities in New York and Germany for applications in automotive, communications infrastructure and SATCOM markets.
“We are delighted to see EXTOLL, in partnership with Chip Interfaces, deliver the industry’s first integrated UCIe solution on our FDX platform that will unlock new capabilities for our customers designing advanced chiplets for next-generation systems spanning Physical AI, Edge AI, automotive, SATCOM and more,” said Sudipto Bose, vice president of product management for GF’s FDX technology.
Source: EXTOLL
About EXTOLL
Extoll GmbH, founded in 2011 as a spin-off of Heidelberg University, is based in Mannheim, Germany. The company develops high-speed, low-power interconnect semiconductor IP for chiplet-based systems, including SerDes, UCIe and network-on-chip products, designed for mainstream technology nodes such as 12–28 nanometers. Focused on high-performance computing, Extoll serves communications, space, industrial and automotive markets. The company has about 50 employees. Its interconnect solutions aim to meet rising energy efficiency demands in edge AI, 5G and 6G, satellite communications and IoT applications.
About Chip Interfaces
Chip Interfaces is a semiconductor intellectual property company based in Copenhagen, Denmark. The company develops and licenses digital interface IP cores for semiconductor and electronic system designs. Its products include JESD204, MIPI, Interlaken, UCIe D2D, DiFi, CPRI, eCPRI, RSFEC, Ethernet MAC, Ethernet PCS, Ethernet TSU and MACsec IP cores. Chip Interfaces also provides integration and verification support. The company serves semiconductor companies, ASIC developers, FPGA designers, system integrators and electronics manufacturers. Its IP cores are used in communications, wireless infrastructure, data transfer, networking, industrial electronics and chip development. The company designs silicon-agnostic IP cores for multiple semiconductor processes and hardware types. It also performs interoperability testing with third-party technologies.
About GlobalFoundries
GlobalFoundries is a semiconductor foundry that provides advanced manufacturing services for integrated circuits. It offers a range of technologies, including CMOS, RF, embedded memory, silicon photonics, and FinFET, catering to automotive, communications, defense, data center, industrial, and consumer electronics applications. Founded in 2009 after being spun off from AMD, GlobalFoundries has over a decade of experience delivering tailored semiconductor solutions. The company supports fabless chipmakers with design enablement, IP services, and process technologies to accelerate innovation and meet global demand. Headquartered in Malta, New York, it operates manufacturing sites in the U.S., Germany, and Singapore. The company develops technologies for emerging markets, supporting digital applications that demand energy efficiency and reliable performance.