ELECTRONICS
Sivers, GlobalFoundries Integrate Lasers for AI Photonics
GF SCALE uses CPO, LPO, CWDM, DWDM, and packaging in data center interconnects
Siemens Names Markus Grabmeier CEO of Electrical Products
Smart Infrastructure appoints former executive with low-voltage, manufacturing, and East Asia operations experience
Siemens Develops NVIDIA AI Factory Reference Architecture
34.5 kV utility-to-rack architecture integrates Fluence storage, controls, and phased capacity for cloud infrastructure
EXTOLL, Chip Interfaces Introduce UCIe IP for GF FDX Tech
Package combines EXTOLL PHY and Chip Interfaces D2D Adapter for die-to-die links
Ultrafast Switching Device Points to a New Era of Energy-Efficient Computing
Japanese researchers develop a processor component that could dramatically increase speed while reducing heat and power demands.
