PITTSBURGH, PA, Apr 3, 2025 – Ansys has announced that PathFinder-SC is certified as a new ESD analysis solution for customers designing with TSMC’s N2 silicon process technology. PathFinder-SC offers a verification solution designed to handle designs in cloud environments. It enables a thorough ESD analysis for P2P and CD earlier in the design process and during final validation. This supports complex designs, such as system-on-chip and multi-die chips, ensuring protection against electrical overstress. The solution contributes to the safety of semiconductor products used in AI, high-performance computing (HPC), 5G mobile communications, automotive, memory, and graphic processors (GPUs).
To promote the cloud as a high-capacity, high-speed option for mutual customers, Ansys and TSMC collaborated to complete certification for SeaScape that includes RedHawk-SC, PathFinder-SC, and RedHawk-SC Electrothermal 3D-IC multiphysics analysis platform. Ansys Totem solution for transistor-level and mixed-signal design is certified, delivering customers the same verification reliability and accuracy when running projects in a distributed cloud environment.
“As the scale and size of chips continues to increase, we need to consider new approaches and new technologies that ensure our customers have access to optimal design solutions that maximize the performance and power efficiency of our cutting-edge process technologies,” said Lipen Yuan, senior director of advanced technology business development at TSMC. “Our collaboration with Open Innovation Platform (OIP) partners like Ansys delivers a proven, reliable verification solution for customers advancing the forefront of semiconductor design.”
“The Ansys multiphysics platform continues to prove itself a strong technical solution for a range of physics, from power integrity to high-speed electromagnetics,” said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. “Our collaboration with TSMC extends multiphysics analysis for joint customers that are designing some of the most complex chips in the world and looking to take advantage of the cloud to accelerate their productivity.”
Source: Ansys
About Ansys
Ansys, founded in 1970, specializes in engineering simulation software. It offers a comprehensive suite of tools for structural analysis, fluid dynamics, electromagnetic field simulation, and more, enabling industries to design and test products virtually. Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. Serving sectors such as aerospace and defense, automotive, energy, industrial equipment, materials and chemicals, consumer products, healthcare, and construction, Ansys supports innovation across diverse fields. As of 2023, the company reported annual revenues exceeding $2.3 billion and employed over 6,200 people worldwide. Headquartered in Canonsburg, Pennsylvania, Ansys continues to advance engineering simulation technologies, empowering organizations to enhance product development processes.
About TSMC
Established in 1987 and headquartered in Hsinchu Science Park, Taiwan, Taiwan Semiconductor Manufacturing Company (TSMC) pioneered the pure-play foundry business model, focusing solely on manufacturing semiconductor products for its clients. TSMC serves various industries, including high-performance computing, smartphones, the Internet of Things (IoT), automotive, and digital consumer electronics. In 2024, the company reported a consolidated revenue of NT$2,894.31 billion. TSMC’s commitment to technological advancement and manufacturing excellence has solidified its position as a leading semiconductor foundry, supporting a thriving ecosystem of global customers and partners.