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Alphawave Semi Delivers 36G UCIe IP on Nanosheet Technology

by | Jun 13, 2025

A new UCIe IP subsystem on a 2nm process supports 36G data rates and integrates advanced packaging for scalable chiplet architectures. Collaboration in chip design and connectivity is driving AI and cloud infrastructure capabilities forward.
Image: Alphawave Semi

LONDON, UK and TORONTO, Canada, June 13, 2025 – Alphawave Semi has completed the tape-out of UCIe IP subsystem using TSMC’s N2 process, enabling 36G die-to-die data rates. This subsystem is integrated with TSMC’s Chip-on-Wafer-on-Substrate (CoareWoS) packaging technology, aiming to improve bandwidth density and scalability for future chiplet architectures.

This milestone follows the recent release of the Alphawave Semi AI Platform, demonstrating capability to support disaggregated SoCs and infrastructure for hyperscale AI and HPC workloads. With this tape-out, Alphawave Semi is among the first to implement UCIe connectivity on 2nm nanosheet technology, a step forward in the open chiplet ecosystem.

“We’re proud to lead the industry into the N2 era with one of the first UCIe IP on this advanced node,” said Mohit Gupta, senior VP and GM, custom silicon & IP, Alphawave Semi. “Our 36G subsystem validates a new class of high-density, power-efficient chiplet connectivity and paves the way for 64G UCIe and beyond – critical for AI and high-radix networking applications.”

Alphawave Semi’s UCIe IP subsystem on TSMC’s 2nm process supports 36G data rates with 11.8 Tbps/mm bandwidth density, low power consumption and latency, along with features like per-lane health monitoring and testability. It complies with the UCIe 2.0 standard and supports multiple protocols, including PCIe, CXL, AXI, CHI, through Alphawave Semi’s Streaming Protocol D2D Controller.

Alphawave Semi is working on ecosystem collaborations to support technologies using D2D-based open chiplet interoperability for AI connectivity in the semiconductor industry. Its UCIe IP on the TSMC N2 process supports scalable, open chiplet ecosystems.

“Our latest collaboration with Alphawave Semi underscores our shared commitment to driving advancements in high-performance computing through design solutions that fully leverage the performance and energy-efficiency advantages of TSMC’s advanced process and packaging technologies,” said Lipen Yuan, senior director of advanced technology business development at TSMC. “This milestone illustrates how close collaboration with our Open Innovation Platform (OIP) partners like Alphawave Semi can enable the quick delivery of advanced interface IP and custom silicon solutions to meet the increasing demands of AI and cloud infrastructure.”

Alphawave Semi is executing on its plans to deliver next-gen UCIe solutions, with 64G UCIe support, empowering AI and HPC customers to lead in a evolving chiplet-driven landscape.

Source: Alphawave Semi

About Alphawave Semi

Alphawave Semi, founded in 2017 and based in Toronto, Canada, develops semiconductor solutions focused on high-speed connectivity for data-intensive applications. The company designs silicon and intellectual property used in data centers, telecommunications, and high-performance computing. Its products support industries such as cloud infrastructure, 5G networks, AI, and enterprise storage by enabling faster and efficient data transfer. Alphawave has experienced revenue growth, surpassing CAD 100 million annually. The company’s technology addresses the need for higher bandwidth and lower latency in modern digital systems. By focusing on scalable and innovative connectivity solutions, Alphawave aims to meet the demands of next-generation data centers and communication networks. Its position reflects the need for specialized semiconductors to handle advancing data transmission demands.

About TSMC

Taiwan Semiconductor Manufacturing Company (TSMC) is the world’s largest dedicated semiconductor foundry, based in Hsinchu, Taiwan. Founded in 1987, TSMC developed the pure-play foundry business model and has become a key player in the global chip supply chain. The company manufactures advanced semiconductor components using process technologies like 5nm and 3nm nodes, with plans to move to 2nm and smaller. TSMC serves customers across industries like consumer electronics, computing, automotive, networking, and industrial applications. Major technology firms rely on TSMC to produce chips for smartphones, data centers, AI systems, and autonomous vehicles. In 2024, the company reported annual revenue of approx. US$88 billion. By the end of 2024, TSMC employed about 84,000 people worldwide. The company served 530 customers and made 11,900 products for various applications. With ongoing investments in new technologies, TSMC remains an integral part of the semiconductor industry.