PITTSBURGH, PA, Apr 25, 2025 – Ansys and TSMC are working together to improve workflows for radio frequency design migration and photonic integrated circuits. Their joint updates include new tool certifications and expanded support for 3D-IC design. The collaboration also extends to the latest N3C technology, building on existing N3P solutions, helping streamline development processes for AI and advanced computing chip applications.
A16 EM/IR and Thermal Certification
RedHawk-SC, RedHawk-SC Electrothermal, and Totem are certified for TSMC’s advanced silicon process A16 with Super Power Rail, a backside power delivery solution for analog/block-level and SoC-level electromigration (EM) and voltage drop (IR) analysis.
To ensure thermal management for the TSMC A16 process, Ansys and TSMC developed a thermal analysis flow. The method uses TSMC’s thermal specifications to calculate temperatures and improve performance in advanced applications. Ansys and TSMC are also collaborating on design enablement for TSMC’s next-gen A14 technology.
Advanced 5nm and 3nm On-Chip Electromagnetic Certification
To support the demand for scalable electromagnetic analysis, Ansys is introducing HFSS-IC product family. HFSS-IC Pro, with RaptorX technology, is certified by TSMC for its advanced 5nm and 3nm processes. The certification meets the design of next-generation semiconductor products. It highlights Ansys’ role in semiconductor design and helps customers develop applications such as AI, HPC, 5G/6G communications, and automotive electronics.
AI-Assisted Photonic Design Optimization
Ansys and TSMC continue to refine COUPE design solutions by leveraging AI capabilities in Ansys optiSLang process integration and design optimization software. These solutions enable PIC optimization with Ansys Lumerical INTERCONNECT and empower optical coupling system optimization and robustness analysis with Ansys Zemax OpticStudio.
AI-Assisted Optimal RF Design Migration
TSMC, Ansys, and Synopsys have enhanced a joint AI-assisted RF migration process. This combines Ansys HFSS-IC Pro AI technology with Synopsys custom compiler and ASO.ai solutions. The process speeds up the transition from one silicon process to another for analog and RF ICs. It automates device placement, routing optimization, and EM-aware tuning while maintaining design intent and performance. As the semiconductor industry moves to advanced nodes, RF IC migration faces challenges in keeping performance, yield, and design productivity. Leveraging AI to predict and address EM challenges ensures signal integrity, power efficiency, and manufacturability in advanced RF applications.
Multiphysics Signoff Analysis Flow Enablement
Ansys RedHawk-SC, RedHawk-SC Electrothermal, and Synopsys 3DIC compiler are integrated into TSMC, Ansys, and Synopsys’ joint multiphysics signoff analysis flow enablement platform for extraction, timing, power, EM/IR, and thermal analysis. These analyses are linked through a shared data flow, supporting thermal-aware timing analysis and voltage-aware timing analysis. This multiphysics approach can help customers accelerate the convergence of large 3D-IC designs.
“Ansys’ continued collaboration with Synopsys and TSMC drives innovation in 3D-IC design and improves chip reliability for the most demanding applications,” said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Ansys. “As chip sizes shrink and energy efficiency demands grow, Ansys continues to advance its multiphysics solutions across electromagnetics, thermal, structural integrity, and more to give our customers confidence that their design will meet specifications. The latest certifications from TSMC highlight our commitment to delivering the most advanced solutions to customers’ most challenging problems.”
“AI-driven solutions significantly boost productivity in designing 3D-IC components and offer seamless automation for essential tasks,” said Lipen Yuan, senior director of advanced technology business development at TSMC. “Our continued collaboration with Open Innovation Platform (OIP) partners like Ansys and Synopsys ensures optimal technical solutions that fully leverage the performance and power efficiency advantages of our cutting-edge technologies, advancing customer innovation across AI, HPC, mobile, automotive, and beyond.”
About Ansys
Ansys, founded in 1970, specializes in engineering simulation software. It offers a comprehensive suite of tools for structural analysis, fluid dynamics, electromagnetic field simulation, and more, enabling industries to design and test products virtually. Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. Serving sectors such as aerospace and defense, automotive, energy, industrial equipment, materials and chemicals, consumer products, healthcare, and construction, Ansys supports innovation across diverse fields. As of 2023, the company reported annual revenues exceeding $2.3 billion and employed over 6,200 people worldwide. Headquartered in Canonsburg, Pennsylvania, Ansys continues to advance engineering simulation technologies, empowering organizations to enhance product development processes.
About TSMC
Taiwan Semiconductor Manufacturing Company (TSMC) is the world’s largest dedicated semiconductor foundry, based in Hsinchu, Taiwan. Founded in 1987, TSMC developed the pure-play foundry business model and has become a key player in the global chip supply chain. The company manufactures advanced semiconductor components using process technologies like 5nm and 3nm nodes, with plans to move to 2nm and smaller. TSMC serves customers across industries like consumer electronics, computing, automotive, networking, and industrial applications. Major technology firms rely on TSMC to produce chips for smartphones, data centers, AI systems, and autonomous vehicles. In 2024, the company reported annual revenue of approx. US$88 billion. By the end of 2024, TSMC employed about 84,000 people worldwide. The company served 530 customers and made 11,900 products for various applications. With ongoing investments in new technologies, TSMC remains an integral part of the semiconductor industry.
About Synopsys
Synopsys Inc., headquartered in Sunnyvale, CA, is a leader in electronic design automation (EDA) and semiconductor intellectual property (IP) solutions. The company provides software tools and services for designing and verifying complex integrated circuits and systems-on-chips (SoCs). Its offerings cater to industries such as semiconductor, automotive, aerospace, and consumer electronics, enabling the development of advanced technologies including artificial intelligence, 5G, and autonomous vehicles. In fiscal year 2024, Synopsys reported an annual revenue of $6.13 billion. As of October 31, 2024, the company employed approximately 20,000 individuals worldwide.