MANNHEIM, Germany, Sep 2, 2025 – Eridan has selected EXTOLL as the SerDes IP supplier for its ASIC development program, with manufacturing handled by GlobalFoundries (GF), enabled via the GlobalShuttle multi-project wafer program on its 22FDX process technology. The partnership targets energy-efficient, high-speed chiplet-based systems for wireless and data applications. Through the partnership with chip interfaces, integrated and verified JESD204 multi-lane solutions are made available, supporting line speeds up to 32Gbps per lane and silicon proven for GF’s 22FDX and 12LP platforms.
“We are delighted and esteemed to jointly work with Eridan and Chip Interfaces on creating solutions for breakthrough technology in 5G coverage and throughput. This collaboration accents EXTOLL´s strength in ultra-low power design, particularly on GlobalFoundries’ 22FDX platform, enabling future communication innovations,” says Dirk Wieberneit, CEO of EXTOLL.
“We are excited to partner with EXTOLL on their industry-leading SerDes technology on GF’s 22FDX platform,“ said Doug Kirkpatrick, Eridan co-founder and CTO. “EXTOLL is continuing to innovate on this process node, enabling a unique solution for best-in-class power and performance that our applications require. This makes them a perfect fit for Eridan’s ambitious lowest power products for 5G small cells, massive MIMO, and beyond.”
“Partnering with EXTOLL and Eridan to deliver an IP solution tailored for the project requirement underscores our commitment to providing technology that directly meets our customers’ evolving demands,” said Anne Voss Winther, CEO at Chip Interfaces. “Our JESD204C IP, supporting line rates up to 32.5Gbps per lane with 64b/66b encoding, has been successfully combined with EXTOLL’s ultra-low-power SerDes on GF’s 22FDX platform to create a fully verified, high-performance interface solution, that enabled the customers project success.”
GF’s 22FDX process technology combines RF/mixed-signal performance and digital logic capabilities to support next-generation communications and SATCOM markets. 22FDX is a depleted SOI platform that supports RF functions, high-speed, high-density digital logic, and low power use. It fits applications that need power efficiency and fast connectivity.
“We are delighted to see our IP partner EXTOLL continuing to innovate on our 22FDX platform, now partnering with Eridan to enable digital 5G radios with high-speed, energy-efficient ASICs,” said Ziv Hammer, senior vice president of design platforms and services at GF. “Working closely with our partners and customers, GF continues to advance global connectivity with essential chips that support the growing demand for faster, more reliable networks with higher bandwidth and increased coverage.”
Source: EXTOLL
About EXTOLL
Extoll GmbH, founded in 2011 as a spin-off of Heidelberg University, is based in Mannheim, Germany. The company develops high-speed, low-power interconnect semiconductor IP for chiplet-based systems, including SerDes, UCIe and network-on-chip products, designed for mainstream technology nodes such as 12–28 nanometers. Originally focused on high-performance computing, as of current date Extoll serves communications, space, industrial and automotive markets. The company has about 45 employees and estimated annual revenue of $14.4M. Its interconnect solutions aim to meet rising energy efficiency demands in edge AI, 5G and 6G, satellite communications and IoT applications.
About ERIDAN
Eridan, founded in 2013 and headquartered in Sunnyvale, CA, with a second location in Zagreb, Croatia, develops software-defined radios using gallium nitride polar modulation technology. Its main product, the MIRACLE Module, delivers low-power, high-performance connectivity for 5G small cells, massive MIMO, IoT and satellite communications. Backed by more than 38 U.S. patents issued or pending, the company grew from a DARPA-supported startup into a telecom equipment provider serving telecommunications, infrastructure, energy, transportation and manufacturing markets. As of 2025, the company recorded approx. $3.8M in annual revenue and employs around 90 people across four continents. Eridan’s radios are designed to reduce energy use and installation complexity, helping organizations deploy wireless networks for connectivity needs.
About GlobalFoundries
GlobalFoundries is a leading semiconductor foundry that provides advanced manufacturing services for integrated circuits. It offers a range of technologies, including CMOS, RF, embedded memory, silicon photonics, and FinFET, catering to automotive, communications, defense, data center, industrial, and consumer electronics applications. Founded in 2009 after being spun off from AMD, GlobalFoundries has over a decade of experience delivering tailored semiconductor solutions. The company supports fabless chipmakers with design enablement, IP services, and process technologies to accelerate innovation and meet global demand. Headquartered in Malta, New York, it operates manufacturing sites in the U.S., Germany, and Singapore. As of 2023, GlobalFoundries reported an annual revenue of approximately $7.4 billion and continues to play a critical role in global supply chains. The company focuses on unique technologies designed to meet the needs of growing markets. It supports new digital applications that require energy efficiency and dependable performance.