MALTA, NY, May 6, 2026 – GlobalFoundries (GF) introduced SCALE (Silicon photonics Co-packaged Advanced Light Engine), an optical module for co-packaged optics in AI scale-up systems. The module supports the Optical Compute Interconnect Multi-Source Agreement (OCI MSA) and uses optical fibers to carry bidirectional data traffic at higher bandwidth density than copper interconnects.
SCALE stands for Silicon Photonics Co-packaged Advanced Light Engine. GF said the module exceeds the OCI MSA optical interconnect specification for modern AI scale-up architectures. It uses coarse and dense wavelength-division multiplexing, or CWDM and DWDM, and GF has demonstrated 8λ and 16λ bidirectional DWDM on the technology.
The module uses GF’s silicon photonics technology and includes qualified photonic devices. These include 50Gbps and 100Gbps micro-ring modulators, coupled ring resonators and integrated photodiodes. SCALE also includes through-silicon vias for high-speed signaling and power delivery. Copper pad pitches range from 110μm to below 45μm for 2.5D and 3D stacking, from organic substrates to silicon interposers.
GF said SCALE integrates electrical ICs on single-digit advanced nodes to connect compute and optical components. The module supports multiple fiber-attach approaches and uses broadband detachable fibers with flat insertion loss over the CWDM spectrum. The fiber design supports scaling from 4λ in each direction to 8λ and beyond, while supporting serviceability and known-good-die testability for next-generation AI interconnects.
“With over a decade of innovation and manufacturing expertise in silicon photonics technology at our disposal, GF stands ready to unlock the future of high-bandwidth, energy-efficient connectivity with our SCALE solution for co-packaged optics,” said Mike Hogan, chief business officer at GF. “Today, our technology already exceeds the requirements set by the OCI MSA, demonstrating our close collaboration with industry leaders and our technology’s readiness to scale next-generation, AI infrastructure.”
Source: GlobalFoundries
About GlobalFoundries
GlobalFoundries is a semiconductor foundry that provides advanced manufacturing services for integrated circuits. It offers a range of technologies, including CMOS, RF, embedded memory, silicon photonics, and FinFET, catering to automotive, communications, defense, data center, industrial, and consumer electronics applications. Founded in 2009 after being spun off from AMD, GlobalFoundries has over a decade of experience delivering tailored semiconductor solutions. The company supports fabless chipmakers with design enablement, IP services, and process technologies to accelerate innovation and meet global demand. Headquartered in Malta, New York, it operates manufacturing sites in the U.S., Germany, and Singapore. The company develops technologies for emerging markets, supporting digital applications that demand energy efficiency and reliable performance.