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Intel Foundry, Keysight Partner on EMIB-T Technology

by | May 6, 2025

A new chiplet packaging approach is making design smoother and more efficient. By using open standards and silicon bridge tech, teams can speed up development and avoid unnecessary rework.
Image: Keysight Technologies

SANTA ROSA, CA, May 6, 2025 – Keysight Technologies announced a collaboration with Intel Foundry to support Embedded Multi-die Interconnect Bridge-T (EMIB-T) technology. This effort focuses on improving packaging solutions for AI and data center markets and includes support for Intel’s 18A process node.

As AI and data center workloads grow in complexity, reliable communication between chiplets and 3DICs becomes critical. High-speed data transfer and power delivery are essential to meet the performance requirements of next-generation semiconductor applications. The industry uses emerging open standards, such as Universal Chiplet Interconnect Express (UCIe) and Bunch of Wires (BoW), to address these needs. These standards define interconnect protocols for chiplet and 3DIC connections within advanced 2.5D/3D or laminate/organic packages, allowing consistent integration across different design platforms.

By adopting these standards and verifying chiplets for compliance and link margin, Keysight EDA and Intel Foundry contribute to a growing chiplet interoperability ecosystem. The collaboration seeks to reduce development costs, lower risk, and speed up innovation in semiconductor design.

Keysight EDA’s Chiplet PHY Designer supports high-speed digital chiplet design for AI and data center applications. It offers simulation for the UCIe 2.0 standard and supports the open compute project BoW standard. As a system-level chiplet and die-to-die (D2D) design tool, Chiplet PHY Designer enables pre-silicon validation and helps streamline the tapeout process.

Suk Lee, VP & GM of ecosystem technology office, Intel Foundry, said: “Our collaboration with Keysight EDA on EMIB-T silicon bridge technology is a pivotal step in advancing high-performance packaging solutions. By integrating standards like UCIe 2.0, we enhance chiplet design flexibility for AI and data center applications, accelerating innovation and ensuring our customers meet next-generation demands with precision.”

Niels Faché, vice president and general manager, Keysight’s design engineering software, said: “Keysight EDA’s pioneering Chiplet PHY Designer continues to redefine pre-silicon validation, empowering chiplet designers with rapid, accurate verification. By proactively embracing evolving standards like UCIe 2.0 and BoW, and now with critical support for Intel Foundry’s EMIB-T, we’re enabling engineers to accelerate innovation and eliminate costly design iterations before manufacturing.”

See Keysight EDA EMIB-T Solution at Intel Foundry Direct Connect

Keysight will demonstrate its EMIB-T workflow for system-level link performance and compliance, featuring Intel Foundry’s EMIB-T technology, at Intel Foundry Direct Connect on April 29th in San Jose.

Source: Keysight Technologies

About Keysight Technologies

Keysight Technologies, established in 2014 as a spin-off from Agilent Technologies, is a leading provider of electronic design and test solutions. Headquartered in Santa Rosa, California, the company offers a portfolio of hardware and software products, including oscilloscopes, signal generators, and electronic design automation (EDA) software. The solutions serve industries, such as telecommunications, aerospace and defense, automotive, energy, semiconductor, and general electronics. As of 2024, Keysight employs approximately 15,500 people and reported annual revenue of $5.0 billion. The company’s global presence spans the Americas, Europe, and Asia Pacific, supporting over 30,000 customers in more than 100 countries. Keysight is known for driving innovation, with over 3,800 patents and a focus on research and development.