LISLE, IL, Apr 17, 2026 – Molex agreed to acquire Teramount Ltd., adding photonic coupler for silicon photonics and co-packaged optics systems. The deal includes Teramount’s TeraVERSE technology, which provides a field-serviceable interface between optical fiber and silicon photonics chips. Molex presented TeraVERSE as part of its CPO solution at OFC 2026, targeting data center infrastructure that requires higher data rates with lower power and cooling demand.
“Teramount’s TeraVERSE technology fills a crucial gap in the CPO stack, offering an advantaged and strategic complement to our optical solutions portfolio. With a practical, detachable fiber-to-chip interface we are afforded a foundational element to realize mainstream CPO adoption,” said Aldo Lopez, president, datacom solutions, Molex. “Combining Teramount’s IP and engineering talent with Molex’s innovative portfolio, manufacturing scale, supply-chain expertise and systems know-how gives customers an integrated, high-volume path to deploy scalable CPO.”
TeraVERSE uses a universal photonic coupler and wafer-level self-aligning optics to connect fibers to photonic chips. The system applies a passive, detachable coupling method that supports larger assembly tolerances and semiconductor-grade wafer-level processes. Compared with active alignment methods, this approach supports scalability as co-packaged optics move toward volume production.
“Harnessing Molex’s global scale and system-level expertise with Teramount’s innovation expertise and detachable, wafer-level coupling technology creates a real pathway for scalable, high-density CPO,” said Hesham Taha, CEO and co-founder of Teramount. “Joining forces with Molex will enable us to accelerate delivery of a manufacturable, serviceable fiber-to-chip interface that meets the pressing needs of AI and hyperscale data centers.”
Molex plans to integrate Teramount’s intellectual property and engineering capabilities with its optical interconnect portfolio and manufacturing operations. The combined capability supports optical connectivity across co-packaged optics and silicon photonics architectures. The acquisition is expected to close in the first half of 2026. Goldfarb Gross Seligman is Molex’s legal advisor, and Gornitzky & Co. is Teramount’s legal advisor.
Source: Molex
About Molex
Molex, founded in 1938 and headquartered in Lisle, Illinois, is a global manufacturer of electronic, electrical, and fiber optic interconnect solutions. The company offers a portfolio of over 100,000 products, including connectors, cable assemblies, switches, and integrated systems. Its solutions support industries such as automotive, aerospace and defense, data centers, cloud computing, telecommunications, transportation, industrial automation, consumer electronics, and healthcare. Molex is known for developing the Molex connector, widely used in computing hardware. Since being acquired by Koch Industries in 2013, the company has expanded its operations to 72 manufacturing facilities across 18 countries, employing around 42,000 people.
About Teramount
Teramount is a semiconductor technology company that develops optical connectivity systems for silicon photonics and high-speed data transfer. Founded in 2013, it is headquartered in Israel. The company designs products including the Universal Photonic Coupler, TeraVERSE, and TeraSPOT, which connect optical fibers to semiconductor chips using wafer-level self-aligning optics and passive alignment methods. Its technology supports chip-to-chip communication, co-packaged optics, and fiber-to-chip interfaces. Teramount serves semiconductor manufacturers, packaging contractors, and companies developing AI processors and network infrastructure. Its systems align with semiconductor manufacturing processes.