LISLE, IL, Feb 19, 2026 – Molex has launched Impress co-packaged copper (CPC) solutions for data centers and AI workflows. The platform supports high-speed data transmission while maintaining signal integrity in dense system designs. Impress uses a compression-based substrate connector and mating cable assembly built on Molex on-substrate and near-ASIC expertise. The solution supports data rates up to 224Gbps PAM-4 and beyond.
“As AI workloads push data centers to their physical limits, we are focused on maximizing efficiency without sacrificing signal integrity,” said Jairo Guerrero, VP & GM, copper solutions, Molex. “Impress is our latest innovation built to help scale infrastructures without exponential increases in power consumption or cost. By enabling high performance at the rack level, Molex is making next-generation compute more technically and economically viable.”
NearStack to ASIC Substrate
Impress is an extension of the NearStack On-the-Substrate (OTS) Connectors portfolio. NearStack introduced a direct-to-chip architecture that moved high-speed signal paths off the board. Molex reports shipping more than one million NearStack units to date. The company states the approach reduces latency and improves space efficiency in mission-critical servers.
Impress co-packaged copper relocates the connection point onto the ASIC package substrate. The two-piece connector shortens high-speed signal paths through the printed circuit board (PCB). This architecture isolates the channel from substrate to interconnect, reducing signal loss and crosstalk. The approach supports signal integrity requirements in dense data center and AI hardware designs.
Faster AI Interconnect Upgrades
Impress uses a compression-attached socket mounted on the substrate to support data center architectures. The attachment method reduces the risk of substrate damage and simplifies rework, maintenance and upgrades. The connector design incorporates over-molded cable strain relief and a mechanical contact wipe feature to maintain mating durability. This approach supports consistent performance in high-speed interconnect applications.
Impress co-packaged copper integrates scalable density and power distribution within a compact form factor. Molex states the architecture supports signal reliability, reduces downtime and allows flexibility in data center and AI interconnect designs.
Engineering the 224G Ecosystem
Impress expands Molex’s 224G product portfolio for data center interconnect applications. Alongside Mirror Mezz Enhanced, Inception and CX2 Dual Speed, it supports higher-speed data transmission in hyperscale data centers. The lineup aligns with traffic driven by generative AI, Large Language Models (LLMs) and cloud computing. It also addresses the transition in network links from 1.6T to 3.2T.
Product Availability
Molex Impress co-packaged copper solutions are available for applications up to 224Gbps PAM-4. Development is underway to support 336G and 448G applications.
Source: Molex
About Molex
Molex, founded in 1938 and headquartered in Lisle, Illinois, is a global manufacturer of electronic, electrical, and fiber optic interconnect solutions. The company offers a portfolio of over 100,000 products, including connectors, cable assemblies, switches, and integrated systems. Its solutions support industries such as automotive, aerospace and defense, data centers, cloud computing, telecommunications, transportation, industrial automation, consumer electronics, and healthcare. Molex is known for developing the Molex connector, widely used in computing hardware. Since being acquired by Koch Industries in 2013, the company has expanded its operations to 72 manufacturing facilities across 18 countries, employing around 42,000 people.