CHENNAI, India, Aug 19, 2025 – Polymatech Electronics has opened a new Printed Circuit Board (PCB) manufacturing plant in Estonia, adding European capacity for high-density interconnect boards used in mobile devices, defense, aerospace, and other electronics sectors.
The new Estonia plant includes a 10,000-square-foot cleanroom with equipments capable of producing 50,000 square meters of High-Density Interconnect (HDI) PCBs annually. Built with European technology, it meets industry standards for mobile, defense, aerospace, automotive, semiconductor, telecom, and security applications.
“Our European-made PCBs, crafted with European expertise and adhering to the highest quality standards, are in high demand across various high-end applications,” said Mr. Eswara Rao Nandam, CEO Polymatech Electronics Limited. “This facility underscores our commitment to innovation, quality, and precision, positioning us to deliver tailored, engineered solutions to some of the most demanding industries.” This development marks a pivotal step in transforming Polymatech into a comprehensive solutions provider, evolving from a component supplier into a product-centric organization.
The Estonia facility underscores Polymatech’s promotion from a component supplier to a product-centric solutions provider. “Since incorporating the Company on November 18, 2024, and commencing operations on August 8, 2025, this facility exemplifies our dedication to quality, reliability, and customer-centric innovation,” said Tarja Rapala, director of Polymatech Electronics and head of PCB Business. “With meticulously maintained equipment and a highly skilled team, we are poised to deliver rapid, sustainable PCB solutions and foster strategic partnerships across Europe.”
Dr. Allen Nejah, chief innovation officer of Polymatech Electronics Limited, added, “This facility is a remarkable achievement that enhances our ability to deliver sophisticated PCB solutions for Europe’s technological and defense sectors. PCB is the mother for electronic equipment and this facility enables Polymatech transformation from component manufacturer to product manufacturer, this will be a paradigm shift in the Polymatech’s business profile and help us to release products faster in the market. This facility portfolio includes high-speed PCBs, advanced HDI PCBs, high-frequency PCBs, and multi-layer configurations – up to 48 layers – designed for high-end electronics.
Mr. Urmas Aruoja, CEO, stated, “We deliver PCBs in as little as 24 hours. Our flexible PCBs are integral to smartphones, notebooks, smart wearable devices, and many other products. Our Substrate-Like PCBs (SLPs), HDI PCBs, Rigid-Flex PCBs (RPCBs), Integrated Circuit Substrates (ICS), RF PCBs, and high-density modules are designed for advanced applications. Our HDI PCBs feature high-density attributes, including laser microvias, sequential lamination structures, fine lines, and high-performance thin materials, enabling greater functionality per unit area. Advanced HDI PCBs incorporate multiple layers of copper-filled stacked microvias, providing complex interconnections for large pin-count, fine-pitch, and high-speed chips in cutting-edge technology products.”
Source: Polymatech Electronics
About Polymatech Electronics
Polymatech Electronics Limited, founded in 2007 and based in Tamil Nadu, India, focuses on developing and manufacturing opto- and compound-semiconductor components. Its product lines include LED chips, microcontrollers, wireless chips, and semiconductor packaging solutions. The company serves industries including automotive, telecommunications, healthcare, lighting, and IoT, providing both front-end and back-end semiconductor processes such as ingot growth, wafer fabrication, and advanced packaging. With more than 17 years in operation, Polymatech has built partnerships and alliances across the semiconductor value chain to support its technology and supply goals. In fiscal year 2024, the company reported revenue of around $150M. Polymatech is expanding its manufacturing capacity to include silicon, silicon carbide, and sapphire wafers, targeting export markets in the U.S., European Union, and Middle East. Its approach combines R&D with high-volume production to meet the global demand for specialized semiconductor materials.