NUREMBERG, Germany and TOKYO, Japan, Mar 12, 2026 – Renesas Electronics has introduced Renesas 365, powered by Altium, a cloud platform for semiconductor and system development. The platform combines device exploration, model-based design, and early concept validation in one environment. Renesas 365 connects silicon development with system-level design workflows across an open ecosystem.
Embedded system development requires engineers to move between application notes, datasheets, and software files. Renesas 365 links these resources in a cloud platform that supports system-level design workflows. With Renesas 365, engineering teams can explore architectures, co-develop hardware and software, and evaluate design trade-offs using shared project data.
Following its concept introduction, Renesas is launching the first phase of Renesas 365 with more than 550 variants from the RA family of microcontrollers (MCUs), an Arm-based MCU portfolio, along with development tools. Model-based evaluation and optimization tools guide engineers toward MCU selections that match system requirements. The platform reviews pin usage, peripherals, timing, power, and system building blocks when recommending devices. Engineers no longer need to review multiple datasheets separately during evaluation. Tasks that once required extended datasheet review can now take minutes, helping teams move from concept to validated design in a cost-effective manner.
“The general availability of Renesas 365 marks a pivotal milestone in realizing Renesas’ Digitalization Vision,” said Gaurang Shah, vice president and general manager of Embedded Processing at Renesas. “By delivering the first phase of an intelligent design environment that supports early-stage development, we are laying the groundwork for the next phase, where hardware and software subsystem elements will be maintained within Renesas 365. This helps our customers build, scale and sustain next-generation software-defined products faster and at lower cost.”
Renesas 365 works with the e²studio integrated development environment (IDE), Flexible Software Package (FSP), and related documentation. The combined toolset supports integrated design workflows created for RA MCU devices, including sensing, power management, and compiler support.
Key features of Renesas 365 include:
- Model-based component and system exploration, discovery and selection
- Digital continuity across systems, hardware and software workflows
- AI-assisted guidance on design constraints, resource management, and error resolution
- Over-the-air (OTA) device management for RA MCUs
Renesas 365 allows existing users to link active e²studio projects and begin working in the platform immediately. For new designs, developers can explore system-level components and solutions to identify compatible devices and assess feasibility. The platform provides system-level context during development phase.
Digitally Connected Hardware and Software Configurations
Renesas 365 tracks design changes as engineers modify their systems and links each iteration to system-level design elements. Teams can review any previous hardware and software configurations during development. Renesas 365 identifies resource and design constraints and suggests possible resolutions. It also supports managing and updating RA-based devices after deployment through an integrated over-the-air (OTA) capability.
An Open Platform Built for Flexibility
Renesas 365 supports electronic system development through an open platform architecture. Developers can integrate third-party components, sensors, and partner tools into system designs. Engineering teams can evaluate design trade-offs and test mixed vendor architectures within a system-level design environment.
Growing the Renesas 365 Ecosystem
Renesas is developing the next phase of Renesas 365 to support subsystem building blocks maintained within the platform. The update will extend support to additional Renesas product families and include more third-party devices. Renesas 365 will define and maintain subsystem elements such as peripheral configuration, power management, and software while maintaining and validating compatibility. Engineers can assemble systems using customizable subsystem building blocks maintained within the platform.
Renesas will showcase Renesas 365 at embedded world 2026 in Nuremberg. The Renesas 365 booth (Hall 4, Stand 305/4-305) will feature demonstrations of RA workflows, model-based system exploration, and validation tools. At the Renesas booth (Hall 1, Stand 234/1-234), the company will present semiconductor products through presentations and demos.
Source: Renesas Electronics
About Renesas Electronics
Renesas Electronics is a semiconductor manufacturer that develops and supplies microcontrollers, analog devices, power semiconductors, system-on-chip products, and connectivity components used in embedded systems. The company provides semiconductor devices and related software for automotive systems, industrial equipment, infrastructure, consumer electronics, and IoT applications. Renesas serves automotive suppliers, electronics manufacturers, device makers, and industrial system developers worldwide. The company designs, manufactures, and markets semiconductor components used in control systems, sensing, power management, and communications. Renesas Electronics was formed in 2010 through the merger of Renesas Technology and NEC Electronics, building on semiconductor businesses of Hitachi and Mitsubishi Electric. The company is headquartered in Tokyo, Japan. Renesas operates design centers, manufacturing facilities, and sales offices across Asia, Europe, and the Americas. Renesas Electronics employs about 23,000 people worldwide.