TOKYO, Japan, Mar 26, 2025 – Renesas Electronics Corp. has introduced a new Bluetooth chip that combines a radio transceiver, an Arm M0+ microcontroller, memory, peripherals, and security features in a compact SoC design. The DA14533, the first automotive-qualified device in the company’s Bluetooth low energy system-on-chip (SoC) family, includes advanced power management features to simplify system integration and reduce power consumption. With its software stack qualified against Bluetooth Core 5.3 and support for extended temperatures, developers can project in applications from tire pressure monitoring and keyless entry to wireless sensors and battery management systems.
Optimized Design to Deliver Unparalleled Power Efficiency
Building on previous Bluetooth LE SoCs (SmartBond Tiny Family), the new DA14533 from Renesas offers improved power management features. It includes an integrated DC-DC buck converter that adjusts output voltage based on system needs. The device uses 3.1mA during transmission and 2.5mA during reception, dropping current to 500nA in hibernation mode. These power-saving functions are designed to help extend the operational life of small-capacity battery-powered systems and meet the power requirements of applications like tire pressure monitoring systems.
Auto-Grade AEC-Q100 Qualified and Up-to-Date Security Features
The DA14533 is an AEC-Q100 Grade 2 certified device, designed to meet the quality and reliability standards for use in challenging automotive environments. Its wide operating temperature range (-40°C to +105°C) ensures consistent performance under demanding conditions, making it well-suited for applications in automotive and industrial systems where durability and stability are key. Built to comply with Bluetooth Core 5.3 specifications, the device includes advanced security features to help protect connected systems from potential threats.
“Our SmartBond Tiny SoC family has seen remarkable success in the industrial market, with over 100 million units shipped to date,” said Chandana Pairla, VP of Connectivity Solutions Division at Renesas. “This new automotive-grade device will enable a new class of Bluetooth LE applications that demand high power efficiency, a small footprint and broader temperature tolerance for next-generation battery-powered automotive and industrial systems.”
Lower Bill-of-Materials Reduces Costs and Simplifies Development
Like other Bluetooth LE SoC devices in the SmartBond Tiny family, the DA14533 requires 6 external components, offering an engineering bill of materials (eBOM).
A single external crystal oscillator (XTAL) is used for both active and sleep modes, eliminating the need for a separate oscillator for sleep mode. The device is compact and is available in a WFFCQFN 22-pin 3.5 x 3.5 mm package, making it suitable for space-constrained automotive applications. With its compact design and low eBOM, the device integrates into limited-space systems, reducing overall system costs and accelerating customer time-to-market.
Key Features of the DA14533
- Arm Cortex-M0+ microcontroller – Standalone application processor or data pump in hosted systems
- 64KB RAM and 12KB One-Time Programmable (OTP) memory
- 4 GHz radio transceiver
- Integrated low IQ buck DC-DC converter
- External SPI flash
- Single XTAL operation (single crystal oscillator)
- Software stack qualified against Bluetooth Core 5.3
- AEC-Q100 Grade 2-qualified with wide operating temperature range support (-40 to +105°C)
- WFFCQFN 22-pin 3.5 x 3.5 mm package
Winning Combinations
Renesas has combined the new Bluetooth LE SoC with the R-Car H3/M3/E3 SoCs, PMICs, and timing devices to offer a wide array of winning combinations including a Tire Pressure Monitoring System.” Winning Combinations are vetted system architectures from mutually compatible devices that work together to bring an optimized, low-risk design for faster time to market. Renesas offers over 400 reference designs that combine various products from its portfolio, aiming to help customers simplify the design process and shorten development time.
Source: Renesas
About Renesas Electronics Corp.
Renesas Electronics Corp. is a Japanese semiconductor manufacturer headquartered in Tokyo, Japan. The company specializes in research, development, design, manufacture, sale, and servicing of semiconductor products. Renesas offers a portfolio that includes microcontrollers, analog products, power devices, and system-on-chip (SoC) solutions. The products serve various industries, notably automotive, industrial, infrastructure, and Internet of Things (IoT) sectors. As of Dec. 31, 2024, Renesas employs approximately 21,204 individuals worldwide. In the fiscal year ending December 31, 2024, Renesas reported revenue of approximately ¥1,348.5 billion, while the company’s operating profit for the same period was approximately ¥223.0 billion.