PLANO, TX, Sep 30, 2025 – Siemens Digital Industries Software has announced that it is collaborating with Advanced Semiconductor Engineering (ASE) to develop 3Dblox-based workflows for the ASE VIPack platform using Siemens’ Innovator3D IC solution, which is certified for the 3Dblox standard.
Siemens and ASE have collaborated to validate 3Dblox workflows for three VIPack technologies, including Fanout Chip-on-Substrate, (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Through Silicon Via (TSV)-based 2.5D and 3D IC.
ASE’s VIPack includes six packaging technology pillars supported by a co-design ecosystem. It provides vertically integrated package solutions and represents ASE’s 3D heterogeneous integration architecture. The platform uses redistribution layer processes, embedded integration, and both 2.5D and 3D technologies. These features help customers integrate multiple chips within a single package.
“Siemens’ Innovator3D IC provides ASE with a rapid design assembly exploration cockpit that can read and write 3Dblox,” said Dr. CP Hung, vice president, corporate R&D at ASE. “This collaboration allows ASE to optimize efficiency by developing 3Dblox definitions for some of our leading-edge VIPack technologies. It offers our customers EDA tool flexibility to quickly overcome package design challenges and accelerate time-to-market.”
3Dblox and Innovator3D IC support System Technology Co-optimization (STCO) for hierarchical device planning. This approach is mandatory for chiplet-based heterogeneous integration using ASE’s VIPack packaging technologies.
“Siemens has had a series of beneficial collaborations with ASE, and we are both committed to 3Dblox for semiconductor package design and verification, as it streamlines the design process and delivers open interoperability,” said AJ Incorvaia, senior vice president, electronic board systems, Siemens Digital Industries Software. “As 3Dblox continues to extend we see even greater value and capability that we can deliver to our mutual customers.”
Source: Siemens
About Siemens Digital Industries Software
Siemens Digital Industries Software, headquartered in Plano, TX, is a business unit of Siemens AG that provides software and services in product lifecycle management, CAD, manufacturing, simulation, and electronic design automation. The company serves industries such as automotive, aerospace, manufacturing, electronics, and semiconductors. Founded in 1963 as United Computing, later known as UGS, it was acquired by Siemens in 2007 and rebranded as Siemens Digital Industries Software in 2019. The business reported revenue of about $6.3B in 2024.
About Advanced Semiconductor Engineering
Advanced Semiconductor Engineering (ASE) is a global provider of semiconductor assembly, testing, packaging, and electronics manufacturing services. Headquartered in Kaohsiung, Taiwan, ASE supplies turnkey assembly, materials sourcing, wafer- and system-level testing, and system integration for chipmakers. The company, founded in 1984, has operated in the semiconductor supply chain for more than 40 years. ASE Technology Holding, the publicly listed parent company, was created in 2018. ASE serves communications, computing, consumer electronics, industrial, automotive, and data center markets worldwide. Its capabilities include IC packaging, wafer-level packaging, system-in-package, chiplet integration, functional and reliability testing, and electronics manufacturing for finished products. In 2024, the company reported consolidated net revenue of NT$595,410M, about US$18.2B. ASE operates manufacturing and testing facilities across Asia, the Americas, and Europe, supporting customers ranging from fabless designers to integrated device manufacturers.