PLANO, TX, May 30, 2025 – Siemens Digital Industries Software has added new participants to its OSAT Alliance program. The initiative is designed to help outsourced semiconductor assembly and test (OSAT) providers create and validate integrated circuit (IC) package assembly design kits (ADKs). These ADKs support the adoption of packaging technologies among fabless semiconductor and systems companies. The program supports efforts to reinforce local semiconductor supply chains.
The OSAT Alliance helps mutual customers to leverage the integrated workflow across Siemens’ EDA portfolio (including Calibre software, Innovator3D IC software, HyperLynx software and Xpedition Package Designer software) and encourage supply-chain partners to develop design flows and assembly design kits (ADKs) enabling customers to design, verify, and validate for semiconductor platforms.
“The OSAT Alliance has been designed to help promote the adoption and growth of advanced semiconductor packaging throughout the industry’s ecosystem and enable system and fabless semiconductor companies to have a friction-free path to emerging packaging technologies,” said AJ Incorvaia, senior vice president and general manager, Electronic Board Systems Division, Siemens Digital Industries Software. “We welcome Mosaic Microsystems and Nhanced Semiconductors and look forward to them joining us on this journey towards a secure domestic semiconductor supply chain in the USA.”
Mosaic Microsystems, headquartered in Rochester NY, will use Siemens‘ EDA technologies to develop ADKs for its thin glass substrate technology for microelectronics applications, photonics, RF/mmWave, MEMS and sensor technologies.
“Joining the OSAT Alliance is a significant step for Mosaic Microsystems as we continue to drive innovation in high-density advanced packaging. Integrating our unique thin glass technology with Siemens’ comprehensive EDA portfolio, alongside the expertise of other alliance members, will unlock new possibilities for our customers,” said Chris Mann, vice president of business development, Mosaic Microsystems. “The development of standardized design flows and ADKs will be instrumental in streamlining the design and assembly process, allowing for more predictable and high-performance outcomes with our advanced substrates.”
NHanced Semiconductors in Morrisville, NC and Odon, IN will employ Siemens EDA technologies to develop ADKs for their silicon interposer technology. This technology targets the industrial, medical, military, and scientific markets.
“Our membership in the Siemens OSAT Alliance provides our customers with a comprehensive software suite to implement superior heterogeneous integration and advanced packaging designs,” said Robert Patti, president, NHanced Semiconductors. “It also expands the benefits of our Foundry 2.0 business model, which integrates best-of-class dies and chiplets from traditional foundries into novel assemblies. The OSAT Alliance is a critical asset in re-shoring advanced packaging to the US.”
Source: Siemens
About Siemens Digital Industries Software
Siemens Digital Industries Software delivers integrated tools and services to support digital transformation across engineering and manufacturing workflows. Its offerings help companies streamline product design, optimize manufacturing, and manage operational data more effectively. The company serves sectors such as automotive, aerospace, industrial equipment, electronics, and consumer goods. Its work in areas like product lifecycle management (PLM) and manufacturing systems plays a key role in advancing digital continuity and efficiency. Headquartered in Plano, Texas, it operates as a business unit of Siemens AG.