PLANO, TX, Sep 30, 2025 – Siemens Digital Industries Software put the spotlight on advanced chip design at the 2025 TSMC North America Open Innovation Platform (OIP) Ecosystem Forum, announcing new collaborations with TSMC on product certifications and design solutions. The joint initiative covers TSMC’s process technologies and open the door for mutual customers to accelerate development with innovations in AI, 3D IC design, and packaging.
“Our longstanding relationship with TSMC underscores the transformative power of collaborative innovation,” said Mike Ellow, CEO, Siemens EDA, Siemens Digital Industries Software. “By combining Siemens’ leading IC and advanced packaging solutions with TSMC’s state-of-the-art process technologies, we enable our mutual customers to achieve new levels of design innovation and faster time-to-market, reshaping the future of semiconductor development.”
“The collaboration with Siemens illustrates our persistent focus to enable our shared customers for the latest and most advanced process and packaging technologies,” said Aveek Sarkar, director of the ecosystem and alliance management division at TSMC. “EDA solutions from our OIP partners have significantly contributed to advancing energy-efficient AI chip innovation, and TSMC will continue working with our ecosystem to enable the rapid proliferation of AI through collaborative efforts.”
New Collaborations and Technology Enablement Readiness Updates Include:
Siemens and TSMC evaluated Design Rule Check (DRC) productivity using Calibre Vision AI. The software applies AI to analyze and rank DRC violations. Testing showed improvements, and both companies jointly validated the results.
Calibre nmPlatform software suite is certified for TSMC’s processes: Calibre nmDRC, Calibre nmLVS, Calibre PERC, and Calibre xACT software are all certified for TSMC’s N3C, N2P, and A16 process technologies, enabling mutual customers to continue accessing Siemens’ signoff technology.
Siemens and TSMC certified Siemens’ Solido simulation suite for SPICE accuracy in TSMC’s N3C, N2P, and A16 process nodes. The certification allows customers to design and verify analog, mixed-signal, RF, standard cell, and memory circuits on these technologies. The collaboration also extends to TSMC’s custom design reference flow (CDRF) for the A16 process. Solido supports reliability-aware simulation, which checks IC aging, self-heating, and safe operation areas (SOA). In addition, TSMC’s A16 flow includes Solido’s variation-aware verification, improving design sensitivity analysis and enabling automated cell optimization.
Siemens is collaborating with TSMC to certify its Aprisa software for the N2P process. The flow has been validated for placement, routing, chip finishing, and engineering change orders (ECOs). Current efforts focus on improving performance, power, and area (PPA) to help customers close designs faster and achieve better results.
Siemens and TSMC have established milestones for 3D IC and enabled design flow for TSMC compact universal photonic engine (TSMC-COUPE) technology. Siemens’ Calibre 3DSTACK software is certified for targeted physical verification solutions while Calibre 3DThermal software is certified for static thermal analysis of designs based on TSMC 3DFabric technologies. Siemens’ Calibre 3DThermal software combines the strengths of Calibre technology for chip level analysis, together with the thermal analysis of Siemens’ Simcenter Flotherm software, providing the visibility into thermal impacts throughout the design flow and ecosystem. Additionally, Siemens tools have been enabled to support customers to design using TSMC-COUPE technology. The companies’ joint activity on silicon photonics includes flow development using Siemens’ Innovator3D IC software, Calibre 3DSTACK software, L-Edit software, Solido simulation suite software, calibre xACT software and calibre interactive software for design, implementation and verification of TSMC’s COUPE technology. Innovator3D IC supports the 3Dblox language format across abstraction levels. Siemens is also working toward certification for requirements as 3Dblox moves toward IEEE standardization.
As part of TSMC’s cloud program, Siemens and TSMC ran Solido simulation suite, Calibre nmDRC, and Calibre PERC software on AWS cloud. The tools, qualified for TSMC’s N2 certification, showed tool accuracy and parallel performance on cloud computing infrastructure. The work focuses on reducing time to tape-out through scalable cloud computing.
Source: Siemens
About Siemens Digital Industries Software
Siemens Digital Industries Software, headquartered in Plano, TX, is a business unit of Siemens AG that provides software and services in product lifecycle management, CAD, manufacturing, simulation, and electronic design automation. The company serves industries such as automotive, aerospace, manufacturing, electronics, and semiconductors. Founded in 1963 as United Computing, later known as UGS, it was acquired by Siemens in 2007 and rebranded as Siemens Digital Industries Software in 2019. The business reported revenue of about $6.3B in 2024.
About TSMC
Taiwan Semiconductor Manufacturing Company (TSMC) is the world’s largest dedicated semiconductor foundry, based in Hsinchu, Taiwan. Founded in 1987, TSMC developed the pure-play foundry business model and has become a key player in the global chip supply chain. The company manufactures advanced semiconductor components using process technologies like 5nm and 3nm nodes, with plans to move to 2nm and smaller. TSMC serves customers across industries like consumer electronics, computing, automotive, networking, and industrial applications. Major technology firms rely on TSMC to produce chips for smartphones, data centers, AI systems, and autonomous vehicles. In 2024, the company reported annual revenue of approx. US$88 billion. By the end of 2024, TSMC employed about 84,000 people worldwide. The company served 530 customers and made 11,900 products for various applications. With ongoing investments in new technologies, TSMC remains an integral part of the semiconductor industry.