GENEVA, Switzerland, Mar 10, 2026 – STMicroelectronics has entered high-volume production of its silicon photonics-based PIC100 platform for optical interconnects in data centers and AI clusters. The platform delivers 800G and 1.6T PIC100 transceivers for hyperscalers building high-capacity network links. The technology increases bandwidth and improves energy efficiency as AI workloads drive demand for faster data center interconnects.
“Following the announcement of its new silicon photonics technology in February 2025, ST is now entering high-volume production for leading hyperscalers. The combination of our technology platform and the superior scale of our 300 mm manufacturing lines gives us a unique competitive advantage to support the AI infrastructure super-cycle,” said Fabio Gualandris, president, quality, manufacturing & technology, STMicroelectronics. “Looking ahead, we are planning and executing on capacity expansions to enable more than quadrupling of production by 2027. This fast expansion is fully underpinned by customers’ long-term capacity reservation commitments.”
“The data center pluggable optics market continues to expand strongly, reaching $15.5 billion in 2025. We expect the market to grow at a compound annual growth rate (CAGR) of 17% from 2025 through 2030, surpassing $34 billion by the end of the forecast period. In addition, co-packaged optics (CPO) will emerge as a rapidly growing segment, contributing more than $9 billion in revenue by 2030. Over the same period, the share of transceivers incorporating silicon photonics modulators is projected to increase from 43% in 2025 to 76% by 2030,” said Dr. Vladimir Kozlov, CEO and chief analyst at LightCounting. “ST’s leading silicon photonics platform coupled with its aggressive capacity expansion plan illustrates its capabilities to provide hyperscalers with secure, long-term supply, predictable quality, and manufacturing resilience.”
Upcoming PIC100 TSV Platform Technology
AI infrastructure growth is increasing pressure on cloud optical interconnect performance. ST’s PIC100 platform targets this constraint with silicon photonics technology that uses low-loss silicon and silicon nitride waveguides, advanced modulators and photodiodes, and edge coupling. Waveguide losses reach as low as 0.4 and 0.5 dB/cm for silicon and silicon nitride.
As PIC100 enters high-volume production, ST is preparing the next step in its roadmap, the PIC100 TSV platform. PIC100 TSV integrates through-silicon via (TSV) technology to support higher optical connectivity density, module integration, and thermal efficiency. The platform supports future Near Packaged Optics (NPO) and co-packaged optics (CPO) architectures as hyperscalers move toward tighter optical and electronic integration for scale-up.
ST will be present at Optical Fiber Communication Conference (OFC 2026) between Mar 15-19 in Los Angeles to discuss its business and technology roadmap.
Source: STMicroelectronics
About STMicroelectronics
STMicroelectronics (ST) is a semiconductor company founded in 1987. It designs and manufactures microcontrollers, sensors, power devices and other analog and mixed-signal components. The company operates as an integrated device manufacturer with in-house production that supports large-volume supply for global markets. Its customers include automotive, industrial, consumer electronics and communications equipment manufacturers. ST also works with technology partners to develop components used in mobility systems, energy and power management equipment and connected devices. The company reports ongoing efforts to reduce emissions across its operations and increase the share of renewable electricity in its manufacturing sites, with a goal to reach full renewable sourcing by 2027. ST is headquartered in Geneva, Switzerland. It serves more than 200,000 customers worldwide and employs about 50,000 people. Its technologies support applications that require efficient power conversion, sensing, processing and connectivity. The company expands its portfolio to support automotive, industrial, consumer and connected system applications through integrated design and manufacturing.
About OFC 2026
Optical Fiber Communication Conference and Exhibition (OFC) is an annual industry conference focused on optical communications and networking technologies. Founded in 1975, the event brings together equipment vendors, researchers, network operators and system integrators working in fiber optics and data center networking. The conference covers products and services such as optical components, fiber systems, transceivers, networking equipment, software tools and test instruments used in telecommunications and data center infrastructure. OFC serves industries including telecommunications, cloud computing, data centers, semiconductor manufacturing and optical networking equipment. The event includes technical sessions, peer-reviewed research presentations, training courses and an exhibition with companies across the optical communications ecosystem. OFC is co-sponsored by Optica, IEEE Communications Society and IEEE Photonics Society.