PITTSBURGH, PA, Sep 30, 2025 – Synopsys and TSMC have semiconductor design with the certification of the Ansys simulation and analysis portfolio for TSMC’s N3C, N3P, N2P, and A16 process technologies. The certification enables final checks before manufacturing, ensuring reliability across advanced nodes. The companies also collaborated on an AI-assisted design flow for the TSMC-COUPE platform, supporting chip development for AI acceleration, high-speed communications, and computing.
Multiphysics and AI-Driven Photonics Design Enablement
Synopsys and TSMC are expanding multiphysics analysis flows to support chip designs using a hierarchical analysis method. The flow includes Ansys RedHawk-SC, Ansys RedHawk-SC electrothermal platform, and Synopsys 3DIC compiler exploration-to-signoff platform. Together, they enable thermal-aware and voltage-aware timing analysis across 3DIC designs.
Ansys optiSLang and Ansys Zemax OpticStudio improve the design of optical coupling systems in TSMC-COUPE architecture. They apply AI-driven optimization and sensitivity analysis to shorten design cycles and improve quality. The tools enable engineers add custom components, including grating couplers optimized through photonic inverse design with Ansys Lumerical FDTD.
Advanced Process Technology Certifications
Ansys RedHawk-SC and Ansys Totem are foundational solutions for digital/analog power integrity that verify products can function and meet performance goals. The solutions aid in validating power integrity of chips using TSMC N3C, N3P, N2P, and A16 process technologies. Likewise, Ansys HFSS-IC Pro solution for electromagnetic modeling of chips is certified for TSMC’s N5 and N3P processes. In addition, Synopsys is collaborating with TSMC on design flow development for TSMC’s A14 process with the first photonic design kit release scheduled for the later part of 2025.
Ansys PathFinder-SC is certified as an electrostatic discharge current density (ESD CD) / Point-to-Point (P2P) for the N2P process. It validates chip resilience against electrical overstress surges. The solution accelerates the design cycles and improves product durability. PathFinder-SC also supports 3D integrated circuits (3DIC) and multi-die systems. Synopsys and TSMC are working to extend its capability for 3DIC analysis.
Ansys HFSS-IC Pro is certified by TSMC for die-level analysis on 5nm and 3nm process nodes. The certification supports applications in AI, high-performance computing, 5G/6G, and automotive electronics.
“Synopsys provides a broad range of design solutions to help semiconductor and system designers tackle the most advanced and innovative products for AI enablement, data center, telecommunications, and more,” said John Lee, vice president and general manager of the semiconductor, electronics, and optics business unit at Synopsys. “Our strong and continuous partnership with TSMC has been a key factor in maintaining our position at the forefront of technology while providing consistent value to our shared customers.”
“TSMC’s advanced process, photonics, and packaging innovations are accelerating the development of high-speed communication interfaces and multi-die chips that are essential for high-performance, energy-efficient AI systems,” said Aveek Sarkar, director of the ecosystem and alliance management division at TSMC. “Our collaboration with OIP ecosystem partners such as Synopsys has delivered an advanced thermal, power and signal integrity analysis flow, along with an AI-driven photonics optimization solution for the next generation of designs.”
Source: Synopsys
About Synopsys
Synopsys Inc., founded in 1986 and based in Sunnyvale, California, provides software and intellectual property for semiconductor design and verification. Its tools support the full chip development process, including electronic design automation, simulation, silicon IP, and software security testing. The company serves a range of industries, including semiconductors, automotive, aerospace, defense, data centers and industrial systems. Synopsys reported revenue of approximately $6.13 billion in fiscal year 2024 and employs more than 20,000 people worldwide. Its technology is used by leading chipmakers and system developers to accelerate innovation in complex areas such as artificial intelligence and advanced computing. Synopsys recently announced plans to acquire Ansys, expanding its capabilities into multiphysics simulation and further strengthening its role in the electronic and system design ecosystem.
About TSMC
Taiwan Semiconductor Manufacturing Company (TSMC) is the world’s largest dedicated semiconductor foundry, based in Hsinchu, Taiwan. Founded in 1987, TSMC developed the pure-play foundry business model and has become a key player in the global chip supply chain. The company manufactures advanced semiconductor components using process technologies like 5nm and 3nm nodes, with plans to move to 2nm and smaller. TSMC serves customers across industries like consumer electronics, computing, automotive, networking, and industrial applications. Major technology firms rely on TSMC to produce chips for smartphones, data centers, AI systems, and autonomous vehicles. In 2024, the company reported annual revenue of approx. US$88 billion. By the end of 2024, TSMC employed about 84,000 people worldwide. The company served 530 customers and made 11,900 products for various applications. With ongoing investments in new technologies, TSMC remains an integral part of the semiconductor industry.