NORTH READING, MA, Aug 5, 2025 – Teradyne has announced the launch of the Magnum 7H, a high-speed memory tester built to meet the demands of high-bandwidth memory (HBM) in gen-AI servers. Engineered for stacked die testing at scale, it combines parallelism, speed, and precision to support the production of HBM devices. Leading HBM manufacturers are accelerating production using Magnum 7H.
“We are thrilled to introduce the Magnum 7H, a revolutionary memory tester that sets a new standard for testing HBM devices,” said Young Kim, president, Memory Test Division, Teradyne. “This innovation represents a significant milestone in our commitment to advancing memory test technology and delivering a tester that not only supports today’s devices but is future-proofed for tomorrow’s devices as well.”
The Magnum 7H is a memory tester that supports multiple HBM versions, including HBM2E, HBM3, HBM3E, HBM4, and HBM4E. It provides test coverage across the manufacturing process, from base-die wafer testing to memory core testing and burn-in, to ensure device quality. The Magnum 7H also supports testing of pre-singulated HBM devices at the Known-Good-Stack-Die (KGSD) or chip-on-wafer level using probers and probe cards, as well as post-singulated HBM devices with bare-die probers and handlers to improve quality.
The Teradyne Magnum 7H delivers:
- Enhanced Device Quality: Superior DPS response time delivers higher device yield.
- Comprehensive Memory and Logic Testing: Magnum 7H is suited for testing HBM stacks that contain both logic base dies and DRAM dies. It delivers memory testing with a flexible Algorithmic Pattern Generator (APG) and logic testing with Logic Vector Memory (LVM) option. The Fail List Streaming (FLS) feature ensures error capture for both memory and logic testing.
- High Performance: High-speed testing of current HBM3/3E and HBM4/4E devices up to 4.5Gbps.
- High Parallelism: Essential for lowering cost-of-test for HBM, the Magnum 7H is configurable for up to 9,216 digital pins and 2,560 power pins, enabling superior touchdown efficiency at probe and resulting in 1.6x increased throughput in mass production environments.
Rising performance and efficiency needs in AI and cloud infrastructure are fueling demand for high-bandwidth memory (HBM). Teradyne has introduced the Magnum 7H memory tester to handle current and future HBM devices. The Magnum 7H offers high parallel test capacity, fast and accurate processing throughout all stages of manufacturing.
Source: Teradyne
About Teradyne
Teradyne designs, develops, and manufactures automated test equipment and robotics systems. Its testing solutions help semiconductor and electronics manufacturers meet strict quality standards. Teradyne’s robotics division offers collaborative and mobile robots that support manufacturing and warehouse operations across various industries. Founded in 1960 and headquartered in North Reading, MA, Teradyne serves sectors including semiconductors, electronics, and industrial automation. The company’s customers include global firms such as Qualcomm, Intel, and Samsung. Teradyne operates through its Semiconductor Test, Product Test, and Industrial Automation divisions. In 2024, the company reported approximately $2.82B in revenue, with a trailing 12-month revenue of $2.83B through mid-2025. With more than 60 years of experience, Teradyne remains a key provider of high-volume testing systems for chips and circuit boards worldwide.