YOKOMAMA, Japan, Mar 26, 2025 – Zuken Inc. announced an agreement with IBM to join the IBM Research AI Hardware Center as a commercial member. The IBM Research AI Hardware Center, a global research hub headquartered at the Albany NanoTech Complex in Albany, NY, aims to develop next-gen chips and systems, including advanced semiconductor packaging, which support the processing power and speed that AI requires.
Zuken has also signed an agreement with IBM for the joint R&D of heterogeneous chip integration packaging solutions, which is critical for AI accelerator architecture. The collaboration will focus on 3D integrated circuit (3DIC) packaging design for advanced semiconductors and optimizing electronic design automation (EDA) workflows. Zuken will support the evaluation of a prototype deep learning accelerator core from IBM’s digital and analog projects. Zuken will assist in developing materials, modeling processes, and refining assembly techniques for interconnecting multiple IC dies in a semiconductor package. The collaboration will also emphasize reliability testing, performance simulation, and hardware validation.
“Zuken is pleased to collaborate with IBM Research as a member of the AI Hardware Center and joint development partner,” said Kazuhiro Kariya, Zuken’s senior managing executive officer and CTO. “Our unique system-level design platform supports innovation in 3DIC heterogeneous integration design process by enabling a practical SOC/package/PCB co-design environment. Zuken aims to play an important role in the next-generation high-end device development ecosystem.”
“We are thrilled to be working with Zuken to accelerate chip packaging and AI hardware innovation,” said Jeff Burns, director of the IBM Research AI Hardware Center. “These advances will play a critical role in unlocking the performance and efficiency needed for the future of AI.”
Zuken views 3DIC packaging design as a key step in driving future technology forward and continues to prioritize R&D in this field. Working closely with industry consortiums plays a significant role in this effort. The partnership with IBM Research highlights a commitment to advancing technology and providing innovative solutions to customers worldwide.
Source: Zuken
About Zuken
Zuken Inc., established in 1976, is a software company headquartered in Yokohama, Japan. The company provides advanced design solutions for printed circuit boards (PCBs), electrical and fluid systems, and 3D cabinet and wire harness layouts, serving industries such as electronics manufacturing, automotive, aerospace, and telecommunications. As of March 31, 2024, Zuken reported annual revenues of ¥38.47 billion. The company employs approximately 1,578 individuals globally. Zuken collaborates with leading companies worldwide to optimize their engineering design processes. For nearly 50 years, Zuken has focused on providing advanced technology solutions to meet the changing needs of the manufacturing industry.
About IBM Research AI Hardware Center
The IBM Research AI Hardware Center, established in 2019, is a research hub headquartered in Albany, NY. It focuses on developing next-generation chips and systems optimized for artificial intelligence (AI) workloads, aiming to enhance computational efficiency and performance. The center serves industries such as technology, healthcare, finance, and automotive by advancing AI hardware solutions. As a division of IBM Research, the center contributes to IBM’s broader operations. In 2024, IBM reported total revenues of $61.9 billion, with the software segment, including AI-related initiatives, generating $6.7 billion in the fourth quarter. IBM employs approximately 270,300 individuals globally.