WESTFORD, MA, Sep 5, 2025 – Zuken has joined the JOINT3 consortium, launched by Resonac Corp., to push semiconductor packaging toward panel-level organic interposers through collaboration among material, equipment, and design companies. Using a 515 x 510 mm prototype line, the group is testing how materials, equipment and design tools can scale future packaging.
Zuken brings experience as an EDA vendor in advanced packaging. In JOINT3, the team works on the practical design, manufacturing, and verification of semiconductor packages that use panel-level organic interposers. Zuken’s role is to develop tools and features that address issues found on the factory floor and in the design loop. By solving those issues, Zuken helps define an efficient design and manufacturing process.
Rising data movement needs are pushing back-end packaging to the forefront of next-generation semiconductors. The industry is expanding 2.xD packages that connect multiple chips in parallel via interposers. As performance climbs, interposers are scaling up, with development shifting from silicon to organic materials. In JOINT3, Zuken is contributing EDA capabilities for designing and verifying panel-level organic interposers, helping teams standardize practical workflows for 2.xD packaging.
Zuken has participated in 2.5D and 3D package design, manufacturing, and verification projects and provided advanced package design environments to customers. In these projects, Zuken supported design and tool development for chip stacking, organic package stacking, and interposers. These technologies are available in CR-8000 Design Force’s 2.5DIC/3DIC design and verification features, and the SoC/package/PCB collaboration design environment.
In JOINT3, Zuken engages in the implementation and validation of semiconductor packaging design and manufacturing using panel-level organic interposers. In addition to verifying the physical structure design and electronics design, Zuken is also planning to develop new functions such as preliminary verification in the design stage that considers the physical properties and chemical characteristics of various materials.
Overview of JOINT3
| Name | JOINT3 (JOINT: Jisso Open Innovation Network of Tops) |
| Objectives | Accelerate the development of materials, equipment, and design tools optimized for panel-level organic interposers through co-creation with participating companies. |
| Participating Companies (listed in alphabetical order) | 27 companies (as of September 3, 2025) |
| Resonac Corporation, AGC Inc., Applied Materials, Inc., ASMPT Singapore Pte. Ltd., Brewer Science, Inc., Canon Inc., Comet Yxlon GmbH, EBARA Corporation, Furukawa Electric Co., Ltd.,
Hitachi High-Tech Corporation, JX Advanced Metals Corporation, Kao Corporation, Lam Research Corporation, LINTEC Corporation, MEC COMPANY LTD., Mitutoyo Corporation, NAMICS Corporation, Nikko-Materials Co., Ltd., OKUNO CHEMICAL INDUSTRIES CO., LTD., Synopsys, Inc., Tokyo Electron Ltd., Tokyo Ohka Kogyo Co., Ltd., TOWA Corporation, ULVAC, Inc., Ushio Inc., ZUKEN Inc., 3M Company |
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| Location | – Advanced Panel Level Interposer Center “APLIC”
(Yuki City, Ibaraki Prefecture, Japan (within the Resonac Shimodate Plant (Minami-yuki) – Packaging Solution Center (Kawasaki City, Kanagawa Prefecture, Japan) |
| Activities | – Developing materials, equipment, and design tools for organic interposers using a panel-level (515 x 510 mm) prototype production line
– Promoting development through co-creation by having material and equipment manufacturers produce common prototypes – Utilizing JOINT3 as a “training ground” for technology and equipment manufacturers to further enhance technologies related to panel-level organic interposers |
Source: Zuken
About Zuken
Zuken Inc., a Yokohama-based software company founded in 1976, develops advanced design tools for printed circuit boards, electrical and fluid systems, and 3D cabinet and wire harness layouts. Serving sectors including electronics manufacturing, automotive, aerospace and telecommunications, Zuken reported ¥38.47B in revenue as of March 31, 2024. The company employs roughly 1,600 people worldwide. Zuken’s core platforms – CR-8000 for electronic design and E3.series for electrical systems – offer 2D/3D system – level toolsets with integrated design data and configuration management. The company is also advancing into model-based systems engineering, aligning with the demand for digital engineering and product lifecycle integration. For nearly five decades, Zuken has supported manufacturers in optimizing complex design processes with engineering solutions.
About Resonac Corporation
Resonac Holdings Corp., formerly known as Showa Denko, is a chemical and industrial materials company based in Tokyo. Founded in 1939, the company operates in petrochemicals, electronics, aluminum products, inorganic materials, mobility and innovation materials. Its offerings include semiconductor materials, specialty chemicals, functional resins, graphite electrodes, aluminum foils and advanced industrial products. Resonac serves industries ranging from automotive and electronics to semiconductors and infrastructure. The company was formed through the 2023 merger of Showa Denko and Showa Denko Materials, formerly Hitachi Chemical. For the 12 months through mid-2025, Resonac reported about $9.1B. Its diversified portfolio positions it as a key supplier to the global semiconductor and electronics supply chain while maintaining a presence in broader manufacturing markets. Headquarters are located in Tokyo.