ELECTRONICS

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Siemens, IBM Bring SysML v2 Model-Based Design to Xcelerator

A web-based modeling tool supports the SysML v2 standard for developing complex systems involving multiple engineering domains. It enables structured data exchange, real-time collaboration, and coordinated workflows across teams.

Keysight Announces Executive Leadership Transitions and Appointments

The leadership change follows a clear succession plan to keep operations steady. It is intended to maintain institutional knowledge while aligning with evolving organizational priorities.

Remcom’s Wireless InSite 4.0 Adds Lunar RF, Mobility Modeling

Release 4.0 introduces capabilities for modeling RF systems in motion and across varying terrains, including lunar surfaces. It supports accurate simulation of changing signal behavior in complex environments.

Siemens Democratizes AI-Driven PCB Design for SMBs

Smaller engineering teams can now access AI-supported PCB design tools that better align with practical workflows. The updated platform combines automation and cloud integration to reduce friction in schematic and layout development.

Siemens to Add Timing Constraint Tech with Excellicon Deal

Timing constraint tools are being integrated to address gaps in SoC design workflows. Better integration means tighter coverage, faster closure, and fewer delays when building complex chips.

FocalPoint, STMicroelectronics Team Up to Improve GNSS for Automotive

A new GNSS upgrade improves signal accuracy in tough driving conditions. It’s designed to help automakers streamline ADAS performance with minimal hardware changes and faster deployment through firmware updates.

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