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    Semiconductors

    Zuken Joins JOINT3 Consortium on Semiconductor Packaging

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    Soft Materials Remember Their Mixing and It Matters

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    A Thimble-Sized Haptic Patch That Makes Wearables Fade Into the Background

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    UW-Madison’s New MOCVD Lab Puts Campus at the Center of Next-Gen...

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    EXTOLL, ERIDAN Partner on Low-Power SerDes IP for 22FDX

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    China’s Chip Gamble: Self-Reliance in a World of U.S. Curbs

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    Natcast Loses Control of CHIPS Act Research Funds

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    Presto Names Frédéric Valentin VP Sales, Marketing

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    Cambricon Powers Ahead as China’s AI Chip Champion

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    Axcelis, GE Aerospace Announce Joint Development Program

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